12-Bit, 80Msps Low Power 3V ADC
| Parameter Name | Attribute value |
| Brand Name | Linear Technology |
| Is it Rohs certified? | incompatible |
| Maker | Linear ( ADI ) |
| Parts packaging code | QFN |
| package instruction | HVQCCN, LCC32,.2SQ,20 |
| Contacts | 32 |
| Manufacturer packaging code | UH |
| Reach Compliance Code | _compli |
| ECCN code | 3A991.C.2 |
| Maximum analog input voltage | 1 V |
| Minimum analog input voltage | -0.5 V |
| Converter type | ADC, PROPRIETARY METHOD |
| JESD-30 code | S-PQCC-N32 |
| JESD-609 code | e0 |
| length | 5 mm |
| Maximum linear error (EL) | 0.0269% |
| Humidity sensitivity level | 1 |
| Number of analog input channels | 1 |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 32 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output bit code | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| Output format | PARALLEL, WORD |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC32,.2SQ,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 235 |
| power supply | 3 V |
| Certification status | Not Qualified |
| Sampling rate | 80 MHz |
| Sample and hold/Track and hold | SAMPLE |
| Maximum seat height | 0.8 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 20 |
| width | 5 mm |
| LTC2229IUH | LTC2229CUH | |
|---|---|---|
| Description | 12-Bit, 80Msps Low Power 3V ADC | 12-Bit, 80Msps Low Power 3V ADC |
| Brand Name | Linear Technology | Linear Technology |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Linear ( ADI ) | Linear ( ADI ) |
| Parts packaging code | QFN | QFN |
| package instruction | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 |
| Contacts | 32 | 32 |
| Manufacturer packaging code | UH | UH |
| Reach Compliance Code | _compli | _compli |
| ECCN code | 3A991.C.2 | 3A991.C.2 |
| Maximum analog input voltage | 1 V | 1 V |
| Minimum analog input voltage | -0.5 V | -0.5 V |
| Converter type | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 code | S-PQCC-N32 | S-PQCC-N32 |
| JESD-609 code | e0 | e0 |
| length | 5 mm | 5 mm |
| Maximum linear error (EL) | 0.0269% | 0.0269% |
| Humidity sensitivity level | 1 | 1 |
| Number of analog input channels | 1 | 1 |
| Number of digits | 12 | 12 |
| Number of functions | 1 | 1 |
| Number of terminals | 32 | 32 |
| Maximum operating temperature | 85 °C | 70 °C |
| Output bit code | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| Output format | PARALLEL, WORD | PARALLEL, WORD |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | HVQCCN |
| Encapsulate equivalent code | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
| Package shape | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 235 | 235 |
| power supply | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified |
| Sampling rate | 80 MHz | 80 MHz |
| Sample and hold/Track and hold | SAMPLE | SAMPLE |
| Maximum seat height | 0.8 mm | 0.8 mm |
| Nominal supply voltage | 3 V | 3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD |
| Terminal pitch | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | 20 | 20 |
| width | 5 mm | 5 mm |
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