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LMV1024_09

Description
PDM Output with Pre-Amplifier for Electret Microphones
File Size504KB,18 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LMV1024_09 Overview

PDM Output with Pre-Amplifier for Electret Microphones

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Description PDM Output with Pre-Amplifier for Electret Microphones PDM Output with Pre-Amplifier for Electret Microphones PDM Output with Pre-Amplifier for Electret Microphones PDM Output with Pre-Amplifier for Electret Microphones PDM Output with Pre-Amplifier for Electret Microphones
Is it Rohs certified? - - conform to conform to conform to
Maker - - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction - - FBGA, BGA6,2X3,20 FBGA, BGA6,2X3,20 FBGA, BGA6,2X3,20
Reach Compliance Code - - compli compli compli
ECCN code - - EAR99 EAR99 EAR99
Nominal bandwidth - - 10 kHz 10 kHz 10 kHz
Commercial integrated circuit types - - AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
harmonic distortion - - 0.03% 0.03% 0.03%
JESD-30 code - - R-PBGA-B6 R-PBGA-B6 R-PBGA-B6
JESD-609 code - - e1 e1 e1
length - - 1.628 mm 1.628 mm 1.628 mm
Humidity sensitivity level - - 1 1 1
Number of channels - - 2 2 2
Number of functions - - 1 1 1
Number of terminals - - 6 6 6
Maximum operating temperature - - 85 °C 85 °C 85 °C
Minimum operating temperature - - -40 °C -40 °C -40 °C
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - FBGA FBGA FBGA
Encapsulate equivalent code - - BGA6,2X3,20 BGA6,2X3,20 BGA6,2X3,20
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) - - 260 260 260
power supply - - 1.8/2.7 V 1.8/2.7 V 1.8/2.7 V
Certification status - - Not Qualified Not Qualified Not Qualified
Maximum seat height - - 0.35 mm 0.35 mm 0.35 mm
Maximum slew rate - - 0.65 mA 0.65 mA 0.65 mA
Maximum supply voltage (Vsup) - - 3 V 3 V 3 V
Minimum supply voltage (Vsup) - - 1.6 V 1.6 V 1.6 V
surface mount - - YES YES YES
Temperature level - - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form - - BALL BALL BALL
Terminal pitch - - 0.5 mm 0.5 mm 0.5 mm
Terminal location - - BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - - 1.128 mm 1.128 mm 1.128 mm

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