1108B10M00000AA datasheet, PDF

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1108B10M00000AA: DescriptionTTL Output Clock Oscillator, 10MHz Nom, PLASTIC, FLAT PACKAGE-14; CategoryPassive components oscillator; File Size919KB，35 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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1108B10M00000AA Overview

TTL Output Clock Oscillator, 10MHz Nom, PLASTIC, FLAT PACKAGE-14

1108B10M00000AA Parametric

Parameter Name	Attribute value
Maker	Microsemi
package instruction	PLASTIC, FLAT PACKAGE-14
Reach Compliance Code	compliant
maximum descent time	5 ns
Frequency Adjustment - Mechanical	NO
frequency stability	50%
JESD-609 code	e4
Installation features	THROUGH HOLE MOUNT
Nominal operating frequency	10 MHz
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Oscillator type	TTL
Output load	10 TTL
physical size	20.07mm x 14.99mm x 3.56mm
longest rise time	5 ns
Nominal supply voltage	5 V
surface mount	NO
maximum symmetry	55/45 %
Terminal surface	GOLD

1108B10M00000AA Preview

REV

DESCRIPTION

CO-27937

DATE

6/20/17

PREP

DF/SM

APPD

EXAMPLES SHOWN IN ACTUAL SIZE

Oscillator Specification, Hybrid Clock

MOUNT HOLLY SPRINGS, PA 17065

THE RECORD OF APPROVAL FOR THIS

DOCUMENT IS MAINTAINED ELECTRONICALLY

WITHIN THE ERP SYSTEM

CODE IDENT NO

Hi-Rel Standard

SIZE

DWG. NO.

REV

00136

OS-68338

UNSPECIFIED TOLERANCES: N/A

SHEET 1 0F 35

1.1

SCOPE

General. This specification defines the design, assembly and functional evaluation of high

reliability, hybrid clock oscillators produced by Vectron International. Devices delivered to

this specification represent the standardized Parts, Materials and Processes (PMP) Program

developed, implemented and certified for advanced applications and extended environments.

Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within OS-68338 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military or Ruggedized COTS environments.

APPLICABLE DOCUMENTS

Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310

MIL-PRF-38534

Standards

MIL-STD-202

MIL-STD-883

Other

DOC007131

QSP-90100

DOC011627

DOC203982

QSP-91502

1.2

2.1

Oscillators, Crystal Controlled, General Specification For

Hybrid Microcircuits, General Specification For

Test Method Standard, Electronic and Electrical Component Parts

Test Methods and Procedures for Microelectronics

Test Specification, OS-68338 Hybrids, Hi-Rel Standard

Quality Systems Manual, Vectron International

Identification Common Documents, Materials and Processes, Hi-Rel XO

DPA Specification

Procedure for Electrostatic Discharge Precautions

3.1

GENERAL REQUIREMENTS

Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent

specification, options are imbedded within it to also produce Class B, Engineering Model and

Ruggedized COTS devices. Devices carry a Class 2 ESDS classification per MIL-PRF-38534.

Item Identification. External packaging choices are of metal flatpacks, DIP’s and ceramic J-

lead 9x14mm and LCC’s with either TTL or ACMOS logic output. Unique Model Number

Series’ are utilized to identify device package configurations and output logic as listed in Table

UNSPECIFIED TOLERANCES

3.2

SIZE

CODE IDENT NO.

DWG NO.

REV.

SHEET

00136

N/A

OS-68338

3.3

Absolute Maximum Ratings.

a. Supply Voltage Range (V

b. Storage Temperature Range (T

STG

c. Junction Temperature (T

d. Lead Temperature (soldering, 10 seconds):

e. Output Source/Sink Current:

-0.5Vdc to +7.0Vdc

-65°C to +125°C

+175°C

+300°C

±70 mA

3.4

3.4.1

Design, Parts, Materials and Processes, Assembly, Inspection and Test.

Design. The ruggedized designs implemented for these devices are proven in military and

space applications under extreme environments. All designs (except Model 1157) utilize a 4-

point crystal mount in compliment with Established Reliability (MIL-ER) componentry. The

Model 1157 utilizes a 3-point crystal mount and replaces the Model 1118 which utilized a 2-

point crystal mount. When specified, radiation hardening up to 100krad(Si) (RHA level R) can

be included without altering the device’s internal topography.

3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting

passive chip component values to offset component tolerances, there will not be fundamental

changes to the design or assembly or parts, materials and processes after first product delivery

of that item without written approval from the procuring activity.

3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-

PRF-55310. These designs have also passed extended dynamic levels of at least:

a. Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)

b. Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms, three

minute duration in each of three mutually perpendicular directions)

c. Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)

3.4.2

Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high

reliability devices produced to this specification.

a. Gold metallization of package elements without a barrier metal.

b. Zinc chromate as a finish.

c. Cadmium, zinc, or pure tin external or internal to the device.

d. Plastic encapsulated semiconductor devices.

e. Ultrasonically cleaned electronic parts.

f. Heterojunction Bipolar Transistor (HBT) technology.

g. ‘getter’ materials

Assembly. Manufacturing utilizes standardized procedures, processes and verification

methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.

MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part

numbers to further verify lot pedigree. Traceability of all components and production lots are

in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part

of the deliverable data package. Devices are handled in accordance with Vectron document

QSP-91502 (Procedure for Electrostatic Discharge Precautions).

3.4.3

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

OS-68338

3.4.4

Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to

this document. Inspection conditions and standards are documented in accordance with the

Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.

Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to

eliminate costs associated with the development/maintenance of device-specific documentation

packages while maintaining performance integrity.

Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.

Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the

same robust designs found in the other device pedigrees. They do not include the provisions of

traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.

DETAIL REQUIREMENTS

Components

Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the

devices. The optional use of Premium Q swept quartz can, because of its processing to remove

impurities, be specified to minimize frequency drift when operating in radiation environments.

In accordance with MIL-PRF-55310, the manufacturer has a documented crystal element

evaluation program.

Passive Components. Passive components will have the same pedigree as the die specified in

paragraph 7.1. When required, Established Reliability (ER) failure level R minimum passive

components are used to the maximum extent possible and procured from QPL suppliers. Lot

evaluations are in accordance with MIL-PRF-38534 or Enhanced Element Evaluation as

specified in Table 7. When used, inductors may be open construction and may use up to 47

gauge wire.

Class S Microcircuits. Microcircuits are procured from wafer lots that have passed MIL-PRF-

38534 Class K Lot Acceptance Tests for Class S/K active devices. The prescribed die carries a

Class 2 ESDS classification in accordance with MIL-PRF-38534. When optionally specified,

further testing in accordance with MIL-PRF-55310 and MIL-PRF-38534 is performed for

radiation hardness assurance and for Enhanced Element Evaluation as specified in Table 6.

Those microcircuits, identified by a unique part number, are certified for 100krad(Si) total

ionizing dose (TID), RHA level R (2X minimum margin). NSC, as the original 54ACT

designer, rates the SEU LET at >40 MeV and SEL at >120MeV for the FACT™ family (AN-

932). Vectron has conducted additional SEE testing in 2008 to verify this performance since

our lot wafer testing does not include these parameters and determinations.

3.4.5

3.4.6

3.4.7

4.1

4.1.1

4.1.2

4.1.3

4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into OS-68338 Design

Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed

MIL-PRF-55310 element evaluations for Class B devices.

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

OS-68338

4.1.4

Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. All leads are Kovar with gold plating over a nickel underplate

Package lots are upscreened in accordance with the requirements of MIL-PRF-38534 as

applicable.

Traceability and Homogeneity. All design pedigrees except option D have active device lots

that are traceable to the manufacturer’s individual wafer; all other elements and materials are

traceable to their manufacturer and incoming inspection lots. Design pedigrees E, R, V and X

have homogenous material. In addition, swept quartz crystals are traceable to the quartz bar

and the processing details of the autoclave lot, as applicable.

Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and

passive devices with Enhanced Element Evaluation as listed in Table 6 and 7 shall be

implemented for the highest reliability preference.

Mechanical.

Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a

corresponding package style. Mechanical Outline information of each package style is found

in the referenced Figure.

Thermal Characteristics. The worst case thermal characteristics of each package style are

found in Table 4.

Electrical.

Input Power. Devices are available with an input voltage of either +5.0 Vdc (±10%) or +3.3

Vdc (±10%). Current is measured, no load, at maximum rated operating voltage.

Temperature Range. Operating range is -55°C to +125°C.

Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. Frequency-

Temperature Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage

Tolerance is ±4 ppm maximum.

Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B

inspection, shall not exceed ±1.5 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year

thereafter.

4.1.5

4.1.6

4.2

4.2.1

4.2.2

4.3

4.3.1

4.3.2

4.3.3

4.3.4

4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated

after 15 days if the measured aging rate is less than half of the specified aging rate. This is a

common method of expediting 30-Day Aging without incurring risk to the hardware and used

quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations

of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally

conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time.

Vectron’s automated aging systems take about 6 data points per day, so a lot of data is

available to do very accurate projections, much more data than what is required by MIL-PRF-

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

OS-68338

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