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CY8C20466-24LQXIT |
CY8C20466-24LQXI |
Description |
Multifunction Peripheral, CMOS, 5 X 5 MM, 0.60 MM HEIGHT, MO-248, QFN-32 |
Multifunction Peripheral, CMOS, 5 X 5 MM, 0.60 MM HEIGHT, MO-248, QFN-32 |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Cypress Semiconductor |
Cypress Semiconductor |
Parts packaging code |
QFN |
QFN |
package instruction |
5 X 5 MM, 0.60 MM HEIGHT, MO-248, QFN-32 |
5 X 5 MM, 0.60 MM HEIGHT, MO-248, QFN-32 |
Contacts |
32 |
32 |
Reach Compliance Code |
unknown |
unknown |
bit size |
8 |
8 |
boundary scan |
NO |
NO |
Bus compatibility |
USB |
USB |
CPU series |
M8C |
M8C |
maximum clock frequency |
25.2 MHz |
25.2 MHz |
JESD-30 code |
S-XQCC-N32 |
S-XQCC-N32 |
JESD-609 code |
e4 |
e4 |
length |
5 mm |
5 mm |
Humidity sensitivity level |
3 |
3 |
Number of I/O lines |
28 |
28 |
Number of terminals |
32 |
32 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
Encapsulate equivalent code |
LCC32,.2SQ,20 |
LCC32,.2SQ,20 |
Package shape |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
power supply |
1.8/5.5 V |
1.8/5.5 V |
Certification status |
Not Qualified |
Not Qualified |
RAM (bytes) |
2048 |
2048 |
RAM (number of words) |
1024 |
1024 |
rom(word) |
32768 |
32768 |
ROM programmability |
FLASH |
FLASH |
Maximum seat height |
0.6 mm |
0.6 mm |
speed |
24 MHz |
24 MHz |
Maximum slew rate |
4 mA |
4 mA |
Maximum supply voltage |
5.5 V |
5.5 V |
Minimum supply voltage |
1.71 V |
1.71 V |
Nominal supply voltage |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
NO LEAD |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
width |
5 mm |
5 mm |