AS7C33512PFS18A-166TQCN datasheet, PDF

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AS7C33512PFS18A-166TQCN: Description3.3V 512K x 18 pipeline burst synchronous SRAM; Categorystorage storage; File Size494KB，20 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]; Environmental Compliance

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AS7C33512PFS18A-166TQCN Overview

3.3V 512K x 18 pipeline burst synchronous SRAM

AS7C33512PFS18A-166TQCN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	4 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
memory density	9437184 bi
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.03 A
Minimum standby current	3.14 V
Maximum slew rate	0.475 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

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Description	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM
Is it Rohs certified?	conform to	-	conform to	incompatible	conform to	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	-	100	100	100	100
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	4 ns	-	4.5 ns	4 ns	4 ns	4 ns
Other features	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	166 MHz	-	133 MHz	166 MHz	166 MHz	166 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e3	-	e3	e0	e3	e0
length	20 mm	-	20 mm	20 mm	20 mm	20 mm
memory density	9437184 bi	-	9437184 bi	9437184 bi	9437184 bi	9437184 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	18	-	18	18	18	18
Number of functions	1	-	1	1	1	1
Number of terminals	100	-	100	100	100	100
word count	524288 words	-	524288 words	524288 words	524288 words	524288 words
character code	512000	-	512000	512000	512000	512000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	85 °C	85 °C
organize	512KX18	-	512KX18	512KX18	512KX18	512KX18
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	-	245	NOT SPECIFIED	245	NOT SPECIFIED
power supply	2.5/3.3,3.3 V	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.03 A	-	0.03 A	0.03 A	0.03 A	0.03 A
Minimum standby current	3.14 V	-	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.475 mA	-	0.425 mA	0.475 mA	0.475 mA	0.475 mA
Maximum supply voltage (Vsup)	3.465 V	-	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	-	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	-	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	-	30	NOT SPECIFIED	30	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm

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