I1760SYIR01 datasheet, PDF - EEWORLD Datasheet

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I1760SYIR01: DescriptionSpeech Synthesizer With RCDG, 120s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28; CategoryAnalog mixed-signal IC Consumption circuit; File Size351KB，24 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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I1760SYIR01 Overview

Speech Synthesizer With RCDG, 120s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

I1760SYIR01 Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP,
Contacts	28
Reach Compliance Code	unknown
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDSO-G28
JESD-609 code	e3
length	17.93 mm
Number of functions	1
Number of terminals	28
On-chip memory type	FLASH
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum read time	120 s
Maximum seat height	2.64 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.4 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.52 mm

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PRELIMINARY

ISD1700

Series

Multi-Message

Single-Chip

Voice Record & Playback Devices

Publication Release Date: January 23, 2007

Revision 1.3-S2

ISD1700 SERIES

TABLE OF CONTENTS

GENERAL DESCRIPTION ..............................................................................................................3

FEATURES......................................................................................................................................4

BLOCK DIAGRAM...........................................................................................................................5

PINOUT CONFIGURATION............................................................................................................6

PIN DESCRIPTION .........................................................................................................................7

MODES OF OPERATIONS .............................................................................................................8

6.1 Standalone (Push-Button) Mode .............................................................................................8

6.2 SPI Mode .................................................................................................................................8

TIMING DIAGRAMS ........................................................................................................................8

7.1 Standalone Operation ..............................................................................................................8

7.2 SPI Operation.........................................................................................................................12

ABSOLUTE MAXIMUM RATINGS ................................................................................................13

8.1 Operating Conditions .............................................................................................................13

ELECTRICAL CHARACTERISTICS .............................................................................................14

9.1 DC Parameters ......................................................................................................................14

9.2 AC Parameters.......................................................................................................................15

TYPICAL APPLICATION CIRCUITS.............................................................................................16

10.1 Good Audio Design Practices ................................................................................................18

PACKAGING .................................................................................................................................19

11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19

11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20

11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21

11.4 Die Information.......................................................................................................................21

ORDERING INFORMATION .........................................................................................................22

VERSION HISTORY......................................................................................................................23

-2-

ISD1700 SERIES

1 GENERAL DESCRIPTION

The Winbond

ISD1700 ChipCorder

Series is a high quality, fully integrated, single-chip multi-

message voice record and playback device ideally suited to a variety of electronic systems. The

message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the

specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz

with an external resistor, giving the user greater flexibility in duration versus recording quality for each

application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices

are optimized for a wide range of battery or line-powered applications.

The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device

incorporates a proprietary message management system that allows the chip to self-manage address

locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a

simple push-button environment. The devices include an on-chip oscillator (with external resistor

control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-

aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width

Modulation (PWM) Class D speaker driver, and current/voltage output.

The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new

message indicator. With vAlert, the device flashes an external LED to indicate that a new message is

present. Besides, four special sound effects are reserved for audio confirmation of operations, such as

“Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.

Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique

single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS)

technology. Audio data are stored directly in solid-state memory without digital compression, providing

superior quality voice and music reproduction.

Voice signals can be fed into the chip through two independent paths: a differential microphone input

and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM)

Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a

standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a

single-ended current or voltage output to drive an external amplifier.

While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power

conservation after an operation is completed.

In the SPI mode, the user has full control via the serial interface in operating the device. This includes

random access to any location inside the memory array by specifying the start address and end

address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register.

This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default

configuration for standalone mode can also be modified by storing the APC data into a non-volatile

have the control and flexibility to implement voice functionality into the high-end products.

Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or

Representatives to verify current or future specifications. Also refer to the website for any related application notes.

-3-

Publication Release Date: January 23, 2007

Revision 1.3-S2

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