TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP1007 Series
SP1007 Series 5pF 8kV Bidirectional Discrete TVS
Description
RoHS
Pb
GREEN
The SP1007 includes back-to-back Avalanche breakdown
diodes fabricated in a proprietary silicon avalanche
technology to provide protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level specified in IEC 61000-
4-2 international standard (Level 4, ±8kV contact discharge)
without performance degradation. The back-to-back
configuration provides symmetrical ESD protection for data
lines when AC signals are present.
Pinout
Features
• ESD, IEC 61000-4-2,
±8kV contact, ±15kV air
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, 2A (8/20 as
defined in IEC 61000-4-5
2
nd
edition)
• Low capacitance of 5pF
(TYP @ V
R
=5V)
• Low leakage current of
0.1μA at 5V
• Space efficient 0201 and
0402 footprin
• AEC-Q101 qualified for
SOD882 package
• Moisture Sensitivity Level
(MSL -1) for SOD882
package
• Halogen free, lead free
and RoHS compliant
AEC-Q101 qualified
Applications
• Mobile Phones
• Smart Phones
• Camcorders
• Portable Medical
• Digital Cameras
• MP3/PMP
• Portable Navigation
Components
• Tablets
• Point of Sale Terminals
Functional Block Diagram
Application Example
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/02/18
TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP1007 Series
Absolute Maximum Ratings
Symbol
I
PP
T
OP
T
STOR
Parameter
Peak Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Value
2.0
-40 to 125
-55 to 150
Units
A
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and
operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 20-40s)
Rating
-55 to 150
150
260
Units
°C
°C
°C
Electrical Characteristics
(T
OP
=25ºC)
Parameter
Reverse Standoff Voltage
Breakdown Voltage
Leakage Current
Dynamic Resistance
Clamp Voltage
1
ESD Withstand Voltage
1
Diode Capacitance
1
Note:
1
Symbol
V
RWM
V
BR
I
LEAK
R
DYN
V
C
V
ESD
C
D
Test Conditions
I
R
=1mA
V
R
=5V with 1 pin at GND
TLP tp =100ns, I/O to GND
,
TLP tp =100ns, I
PP
=30A
,
IEC 61000-4-2 (Contact Discharge)
IEC 61000-4-2 (Air Discharge)
Reverse Bias=0V
Min
Typ
8.5
0.1
0.8
34
Max
6.0
9.5
0.5
Units
V
V
μA
Ω
50
V
kV
kV
±8
±15
5
6
pF
Parameter is guaranteed by design and/or component characterization.
Capacitance vs. Reverse Bias
8/20μs Pulse Waveform
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/02/18
TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP1007 Series
Insertion Loss (S21) I/O to GND
Capacitance vs. Reverse Bias
Transmission Line Pulsing(TLP) Plot
Product Characteristics of SOD-882 Package
Lead Plating
Lead Material
Lead Coplanarity
Substrate material
Body Material
Flammability
Pre-Plated Frame
Copper Alloy
0.004 inches(0.102mm)
Silicon
Molded Compound
UL Recognized compound meeting
flammability rating V-0.
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp (T
L
)
to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
Temperature
T
P
T
L
T
S(max)
Preheat
Ramp-up
t
P
Critical Zone
T
L
to T
P
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
t
L
Ramp-do
Ramp-down
T
S(min)
t
S
time to peak temperature
25
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/02/18
TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP1007 Series
Part Numbering System
Ordering Information
Part Number
SP1007-01WTG
SP1007-01ETG
Package
0201 Flipchip
SOD882
Marking
••
•b
Min. Order Qty.
10000
10000
Part Marking System
SP1007-01WTG
SP1007-01ETG
Package Dimensions — 0201 Flip Chip
0201 Flipchip
Symbol
Min
A
B
C
D
E
F
G
0.595
0.295
0.245
0.145
0.245
0.245
0.005
Millimeters
Typ
0.620
0.320
0.275
0.150
0.250
0.250
0.010
Max
0.645
0.345
0.305
0.155
0.255
0.255
0.015
Min
0.0234
0.0116
0.0096
0.0057
0.0096
0.0096
0.0002
Inches
Typ
0.0244
0.0126
0.0108
0.0059
0.0098
0.0098
0.0004
Max
0.0254
0.0136
0.0120
0.0061
0.0100
0.0100
0.0006
Package Dimensions — SOD882
Package
Symbol
JEDEC
Millimeters
Min
A
B
C
D
E
F
0.20
0.45
0.95
0.55
0.50
Typ
1.00
0.60
0.55
0.45
0.25
0.50
0.30
0.55
0.008
0.018
Max
1.05
0.65
0.60
Min
0.037
0.022
0.020
SOD882
MO-236
Inches
Typ
0.039
0.024
0.022
0.018
0.010
0.020
0.012
0.022
Max
0.041
0.026
0.024
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/02/18
TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP1007 Series
Embossed Carrier Tape & Reel Specification — 0201 Flipchip
Symbol
A0
B0
D
D1
E
F
K0
P0
P1
P2
W
T
Millimeters
0.41+/-0.03
0.70+/-0.03
ø 1.50 + 0.10
ø 0.20 +/- 0.05
1.75+/-0.10
3.50+/-0.05
0.38+/-0.03
2.00+/-0.05
2.00+/-0.05
4.00+/-0.10
8.00 + 0.30 -0.10
0.23+/-0.02
8mm TAPE AND REEL
Embossed Carrier Tape & Reel Specification — SOD882
Symbol
A0
B0
K0
F
P1
W
Millimeters
0.70+/-0.045
1.10+/-0.045
0.65+/-0.045
3.50+/-0.05
2.00+/-0.10
8.00 + 0.30 -0.10
8mm TAPE AND REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at
www.littelfuse.com/disclaimer-electronics.
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/02/18
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