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1N6626D3B

Description
1.75A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size276KB,4 Pages
ManufacturerSEMELAB
Download Datasheet Parametric View All

1N6626D3B Overview

1.75A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN

1N6626D3B Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSEMELAB
package instructionR-CDSO-N2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
applicationULTRA FAST RECOVERY POWER
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeR-CDSO-N2
Maximum non-repetitive peak forward current75 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Maximum output current1.75 A
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage200 V
Maximum reverse recovery time0.03 µs
surface mountYES
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
ULTRA FAST RECOVERY
POWER RECTIFIER
1N6626D3A / 1N6626D3B
High Reliability Screening Options Available
High forward current surge current capability
Switching power supplies or other applications requiring
fast switching and low forward loss
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VRWM
1
IO
IFSM
2
TJ
Tstg
TSP
Working Peak Reverse Voltage
Average Rectified Forward Current TA = 25°C
Peak Forward Current Surge
Junction Temperature Range
Storage Temperature Range
Maximum Soldering Pad Temperature for 20s
200V
1.75A
75A
-65 to +175°C
-65 to +175°C
260°C
THERMAL PROPERTIES
Symbols
R
θJSP(IN)
R
θJA(PCB)
(3)
R
θJA(PCB)
(4)
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
Max.
40
72.5
110
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
85°C/W.
(2) TA = 25°C @ IO=0A and VRWM = 0V for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.5A @ TA = 25°C for PC boards where R
θJA(PCB)
111°C/W. Derate at 10mA/°C above TA = 25°C in this case.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
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