Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 4 |
Reach Compliance Code | compli |
ECCN code | 5A991.G |
JESD-30 code | S-PBGA-B4 |
JESD-609 code | e1 |
length | 0.84 mm |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 4 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 0.69 mm |
Nominal supply voltage | 2.7 V |
surface mount | YES |
technology | BICMOS |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.4 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 0.84 mm |
Base Number Matches | 1 |