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MCP37231-200E/TL

Description
ADC, Flash Method
CategoryAnalog mixed-signal IC    converter   
File Size3MB,152 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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MCP37231-200E/TL Overview

ADC, Flash Method

MCP37231-200E/TL Parametric

Parameter NameAttribute value
MakerMicrochip
package instructionHVBCC, LGA124,18X18,20
Reach Compliance Codecompliant
Converter typeADC, FLASH METHOD
Output bit codeOFFSET BINARY
MCP37231/21-200
MCP37D31/21-200
200 Msps, 16/14-Bit Low-Power ADC with 8-Channel MUX
Features
• Sample Rates:
- 200 Msps for single-channel mode
- 200 Msps/number of channels used
• SNR with f
IN
= 15 MHz and -1 dBFS:
- 74.7 dBFS (typical) at 200 Msps
• SFDR with f
IN
= 15 MHz and -1 dBFS:
- 90 dBc (typical) at 200 Msps
• Power Dissipation with LVDS Digital I/O:
- 490 mW at 200 Msps
• Power Dissipation with CMOS Digital I/O:
- 436 mW at 200 Msps, Output Clock = 100 MHz
• Power Dissipation Excluding Digital I/O:
- 390 mW at 200 Msps
• Power-Saving Modes:
- 144 mW during Standby
- 28 mW during Shutdown
• Supply Voltage:
- Digital Section: 1.2V, 1.8V
- Analog Section: 1.2V, 1.8V
• Selectable Full-Scale Input Range: up to 2.975 V
P-P
• Input Channel Bandwidth: 500 MHz
• Channel-to-Channel Crosstalk in Multi-Channel
Mode (Input = 15 MHz, -1 dBFS): >95 dB
• Output Data Format:
- Parallel CMOS, DDR LVDS
- Serialized DDR LVDS (16-bit, octal-channel mode)
• Optional Output Data Randomizer
• Built-In ADC Linearity Calibration Algorithms:
- Harmonic Distortion Correction (HDC)
- DAC Noise Cancellation (DNC)
- Dynamic Element Matching (DEM)
- Flash Error Calibration
• Digital Signal Post-Processing (DSPP) Options:
- Decimation filters for improved SNR
- Fractional Delay Recovery (FDR) for time-
delay corrections in multi-channel operations
(dual-/octal-channel modes)
- Phase, Offset and Gain adjust of individual
channels
- Digital Down-Conversion (DDC) with I/Q or
f
S
/8 output (MCP37D31/21-200)
- Continuous wave beamforming for octal-
channel mode (MCP37D31/21-200)
• Serial Peripheral Interface (SPI)
• Auto Sync Mode to Synchronize Multiple Devices
to the Same Clock
• AEC-Q100 Qualified (Automotive Applications)
• Package Options:
(a) TFBGA-121 (8 mm x 8 mm x 1.08 mm):
- AEC-Q100 qualified
- Temperature Grade 1: -40°C to +125°C
- Includes embedded decoupling capacitors for
reference pins and bandgap output pin
(b) VTLA-124 (9 mm x 9 mm x 0.9 mm)
- Temperature Range: -40°C to +85°C
Typical Applications
Communication Instruments
Cellular Base Stations
Lidar and Radar
Ultrasound and Sonar Imaging
Scanners and Low-Power Portable Instruments
Industrial and Consumer Data Acquisition System
MCP372X1/MCP37DX1-200 Family Comparison
(1)
:
Part Number
MCP37231-200
MCP37221-200
MCP37211-200
MCP37D31-200
MCP37D21-200
MCP37D11-200
Note 1:
2:
3:
4:
Sample Rate
200 Msps
200 Msps
200 Msps
200 Msps
200 Msps
200 Msps
Resolution
16
14
12
16
14
12
Digital
CW
Digital
(2)
(3)
Down-Conversion
Beamforming
(4)
Decimation
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Yes
Yes
Yes
No
No
No
Yes
Yes
Yes
Noise-Shaping
Requantizer
(2)
No
No
Yes
No
No
Yes
Devices in the same package type are pin-to-pin compatible.
Available in single- and dual-channel modes.
Available in single- and dual-channel modes, and octal-channel mode when CW beamforming is enabled.
Available in octal-channel mode.
2014-2019 Microchip Technology Inc.
DS20005322E-page 1

MCP37231-200E/TL Related Products

MCP37231-200E/TL MCP37221T-200E/TE MCP37221T-200E/TL MCP37231-200E/TE
Description ADC, Flash Method ADC, Flash Method ADC, Flash Method ADC, Flash Method
Maker Microchip Microchip Microchip Microchip
Reach Compliance Code compliant compliant compliant compliant
Converter type ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD
Output bit code OFFSET BINARY OFFSET BINARY OFFSET BINARY OFFSET BINARY

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