Standard SRAM, 256X4, 45ns, TTL, CDFP24, CERAMIC, FP-24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | AMD |
Parts packaging code | DFP |
package instruction | DFP, FL24,.4 |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 45 ns |
JESD-30 code | R-CDFP-F24 |
JESD-609 code | e0 |
length | 15.367 mm |
memory density | 1024 bit |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 24 |
word count | 256 words |
character code | 256 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 256X4 |
Output characteristics | OPEN-COLLECTOR |
Exportable | YES |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP |
Encapsulate equivalent code | FL24,.4 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Maximum seat height | 2.286 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 9.525 mm |