Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, 0.068 X 0.058 INCH, DIE-20
Parameter Name | Attribute value |
Maker | AMD |
Parts packaging code | DIE |
package instruction | DIE, DIE OR CHIP |
Contacts | 20 |
Reach Compliance Code | unknown |
Other features | CASCADABLE |
series | TTL/H/L |
JESD-30 code | R-XUUC-N20 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | IDENTITY COMPARATOR |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | SERIES-RESISTOR |
Output polarity | INVERTED |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Encapsulate equivalent code | DIE OR CHIP |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
power supply | 5 V |
Maximum supply current (ICC) | 40 mA |
propagation delay (tpd) | 21 ns |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal location | UPPER |
AM25LS2521XM | AM25LS2521FM | AM25LS2521PC | AM25LS2521DC | AM25LS2521DM | AM25LS2521LC | AM25LS2521LM | AM25LS2521XC | |
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Description | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, 0.068 X 0.058 INCH, DIE-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, CDFP20, FP-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, PDIP20, PLASTIC, DIP-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, CQCC20, LCC-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, CQCC20, LCC-20 | Identity Comparator, TTL/H/L Series, 8-Bit, Inverted Output, TTL, 0.068 X 0.058 INCH, DIE-20 |
Parts packaging code | DIE | DFP | DIP | DIP | DIP | QLCC | QLCC | DIE |
package instruction | DIE, DIE OR CHIP | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIE, DIE OR CHIP |
Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
Other features | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE |
series | TTL/H/L | TTL/H/L | LS | LS | LS | TTL/H/L | TTL/H/L | TTL/H/L |
JESD-30 code | R-XUUC-N20 | R-CDFP-F20 | R-PDIP-T20 | R-CDIP-T20 | R-CDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-XUUC-N20 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR |
Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
Output characteristics | SERIES-RESISTOR | SERIES-RESISTOR | SERIES-RESISTOR | SERIES-RESISTOR | SERIES-RESISTOR | SERIES-RESISTOR | SERIES-RESISTOR | SERIES-RESISTOR |
Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
encapsulated code | DIE | DFP | DIP | DIP | DIP | QCCN | QCCN | DIE |
Encapsulate equivalent code | DIE OR CHIP | FL20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ | DIE OR CHIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
Package form | UNCASED CHIP | FLATPACK | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
propagation delay (tpd) | 21 ns | 21 ns | 19 ns | 19 ns | 21 ns | 19 ns | 21 ns | 19 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | NO | NO | YES | YES | YES |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal form | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
Terminal location | UPPER | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | UPPER |
Maker | AMD | - | - | - | AMD | AMD | AMD | AMD |
Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Lead free | Contains lead | Contains lead | - |
Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 | - |
length | - | 12.827 mm | 26.289 mm | 24.4602 mm | 24.4602 mm | 8.89 mm | 8.89 mm | - |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
Maximum seat height | - | 2.159 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | - |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal pitch | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
width | - | 6.731 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | - |