MOLDED WIREWOUND CHIP INDUCTORS
1. PART NO. EXPRESSION :
WI565050-1R0KF-
(a)
(b)
(e)
(c) (d)
(f)
WI565050 SERIES
(a) Series code
(b) Dimension code
(c) Inductance code : 1R0 = 1.00uH
(d) Tolerance code : J = ±5%, K = ±10%, M = ±20%
(e) F : RoHS Compliant
(f) 11 ~ 99 : Internal controlled number
2. CONFIGURATION & DIMENSIONS :
A
B
C
F
E
I
G
I
D
822
PCB Pattern
A
5.6±0.3
B
5.0±0.2
C
4.0±0.3
D
1.1 Ref.
E
4.0±0.1
F
0.7±0.1
G
4.0 Ref.
H
Unit:m/m
H
4.5 Ref.
I
2.0 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
d
c
e
(a) Core
(b) Wire
(c) Terminal
(d) Capsulate
(e) Epoxy
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.10.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
MOLDED WIREWOUND CHIP INDUCTORS
5. GENERAL SPECIFICATION :
a) Temp. rise : 20°C Max.
d) Operating temp. : -40°C to +105°C
f) Rated current : Current cause inductance drop within 10%
WI565050 SERIES
6. ELECTRICAL CHARACTERISTICS :
Part No.
WI565050-1R0 F-
WI565050-1R2
WI565050-1R5
WI565050-1R8
WI565050-2R2
WI565050-2R7
WI565050-3R3
WI565050-3R9
WI565050-4R7
WI565050-5R6
WI565050-6R8
WI565050-8R2
WI565050-100
WI565050-120
WI565050-150
WI565050-180
WI565050-220
WI565050-270
WI565050-330
WI565050-390
WI565050-470
WI565050-560
WI565050-680
WI565050-820
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
Inductance
( µH )
1.00
1.20
1.50
1.80
2.20
2.70
3.30
3.90
4.70
5.60
6.80
8.20
10.00
12.00
15.00
18.00
22.00
27.00
33.00
39.00
47.00
56.00
68.00
82.00
Tolerance
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
K, M
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
Q
Min.
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
Test
Frequency
( MHz )
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
SRF
( MHz )
Min.
95
70
55
47
42
37
34
32
29
26
24
22
19
17
16
14
13
11.5
10.5
9.5
8.5
7.8
7.0
6.4
RDC
( )
Max.
0.030
0.035
0.04
0.05
0.06
0.07
0.08
0.09
0.11
0.13
0.15
0.18
0.21
0.25
0.30
0.36
0.43
0.52
0.62
0.72
0.85
1.0
1.2
1.4
IDC
( mA )
Max.
1800
1700
1600
1400
1300
1200
1120
1050
950
880
810
750
690
630
580
530
480
440
400
370
340
310
290
270
Tolerance : J = ±5%
K = ±10%
M = ±20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.10.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
MOLDED WIREWOUND CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS :
Part No.
WI565050-101
WI565050-121
WI565050-151
WI565050-181
WI565050-221
WI565050-271
WI565050-331
WI565050-391
WI565050-471
WI565050-561
WI565050-681
WI565050-821
WI565050-102
WI565050-122
WI565050-152
WI565050-182
WI565050-222
WI565050-272
WI565050-332
WI565050-392
WI565050-472
WI565050-562
WI565050-682
WI565050-822
WI565050-103
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
F-
Inductance
( µH )
100.00
120.00
150.00
180.00
220.00
270.00
330.00
390.00
470.00
560.00
680.00
820.00
1000.00
1200.00
1500.00
1800.00
2200.00
2700.00
3300.00
3900.00
4700.00
5600.00
6800.00
8200.00
10000.00
Tolerance
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
J, K
Q
Min.
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
15
Test
Frequency
( MHz )
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.0796
SRF
( MHz )
Min.
6.0
5.4
4.8
4.4
3.9
3.6
3.2
2.9
2.6
2.4
2.2
2.0
1.8
1.5
1.4
1.3
1.2
1.1
1.0
1.0
0.9
0.8
0.7
0.6
0.5
WI565050 SERIES
RDC
( )
Max.
1.6
1.9
2.2
2.8
3.4
4.2
4.9
5.8
7.0
8.5
10
13
15
17
20
30
35
55
60
70
78
85
110
125
150
IDC
( mA )
Max.
250
230
210
190
170
155
140
130
120
110
100
90
85
75
70
60
55
45
40
38
36
33
30
28
25
Tolerance : J = ±5%
K = ±10%
M = ±20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.10.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
MOLDED WIREWOUND CHIP INDUCTORS
7. RELIABILTY TEST :
WI565050 SERIES
ITEM
Environmental Tests
High Temperature Storage Test
Reference documents:
MIL-STD-202G Method 108A
PERFORMANCE
TEST CONDITION
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
Temperature : 85±2°C
Time : 96±2 hours
Tested after 1 hour at room temperature
Temp
85°C
Room
Temp
0
High temperature
1H
96H Test Time
Low Temperature Storage Test
Reference documents:
IEC 68-2-1A 6.1 6.2
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
Temperature : -25±2°C
Time : 96±2 hours
Tested after 1 hour at room temperature
Room
Temp
0
-25°C
Temp
Low temperature
96H
1H
Test
Time
Humidity Test
Reference documents:
MIL-STD-202G Method 103B
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
Temperature : 40±2°C
Humidity : 93±3% RH
Time : 96±2 hours
Tested after 1 hour at room temperature
40°C
93%RH
Temp & Humidity
High temperature
Room High humidity
Temp
1H
0
96H Test
Time
Room
Conditions
Thermal shock test
Reference documents:
MIL-STD-202G Method 107G
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
Conditions of 1 cycle :
Step 1 : -40°C for 30 minute
Step 2 : 125°C for 30 minute
Total : 20 cycles
Temp
85°C
Room
Temp
0
-25°C
1/2H Time
1/2H
Physical Characteristics Tests
Solderability Test
Reference documents:
MIL-STD-202G Method 208H
IPC J-STD-002B
More than 95% of termincal electrode should
be covered with solder.
Solder temperature : 245±5°C
Dip time : 5 secs.
Solder : lead free
Flux : rosin flux
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.10.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
MOLDED WIREWOUND CHIP INDUCTORS
7. RELIABILTY TEST :
WI565050 SERIES
ITEM
Heat Endurance of
Reflow Soldering
Reference documents:
IPC J-STD-020B
PERFORMANCE
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
TEST CONDITION
Refer to reflow curve.
No. of cycle : 3
Peak temp. : 245±5°C
Vibration Test
Reference documents:
MIL-STD-202G Method 201A
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
Frequency : 10~55Hz
Amplitude : 0.75mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Freq
55Hz
10Hz
1Min
Time
Drop Test
Reference documents:
MIL-STD-202G Method 203C
1. No case deformation or change in appearance.
2. L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10% or 15%
Drop from a height of 1m with 981m/s² (100G) altitude
(1 angle, 1 ridge and 2 surface orientations)
Terminal Strength Push Test
Reference documents:
JIS C 5321:1997
Pulling Test :
A : Sectional area of terminal
Bend PCB at middle point, the deflection shall be 2mm.
Pulling Test :
Force
A<8mm²
8mm²<A<20mm²
20mm²<A
>5N
>10N
>20N
Time (sec)
30
10
10
X
Bending Test :
R0.5
1.0
Y
Bending Test : The terminal electrode & the
dielectric must not be damaged by the forces
applied on the right conditions.
Sample
Reflow Curve
300
250
270
270
200
150
100
50
Preheat
R amp-up
Peak
Ram p-dow n
260±5°C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.10.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
Test/Measurement
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