DUAL 2-CHANNEL, DBL POLE DBL THROW SWITCH, QCC16
MAX4699_11 | MAX4699ETE | MAX4701ETE | |
---|---|---|---|
Description | DUAL 2-CHANNEL, DBL POLE DBL THROW SWITCH, QCC16 | DUAL 2-CHANNEL, DBL POLE DBL THROW SWITCH, QCC16 | DUAL 2-CHANNEL, DBL POLE DBL THROW SWITCH, QCC16 |
Is it lead-free? | - | Contains lead | Contains lead |
Is it Rohs certified? | - | incompatible | incompatible |
Maker | - | Maxim | Maxim |
Parts packaging code | - | QFN | QFN |
package instruction | - | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.12SQ,20 |
Contacts | - | 16 | 16 |
Reach Compliance Code | - | _compli | _compli |
Analog Integrated Circuits - Other Types | - | DPDT | DPDT |
JESD-30 code | - | S-XQCC-N16 | S-XQCC-N16 |
JESD-609 code | - | e0 | e0 |
length | - | 4 mm | 3 mm |
Humidity sensitivity level | - | 1 | 1 |
Number of channels | - | 2 | 2 |
Number of functions | - | 2 | 2 |
Number of terminals | - | 16 | 16 |
Nominal off-state isolation | - | 76 dB | 76 dB |
On-state resistance matching specifications | - | 2 Ω | 2 Ω |
Maximum on-state resistance (Ron) | - | 75 Ω | 75 Ω |
Maximum operating temperature | - | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C |
output | - | SEPARATE OUTPUT | SEPARATE OUTPUT |
Package body material | - | UNSPECIFIED | UNSPECIFIED |
encapsulated code | - | HVQCCN | HVQCCN |
Encapsulate equivalent code | - | LCC16,.16SQ,25 | LCC16,.12SQ,20 |
Package shape | - | SQUARE | SQUARE |
Package form | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | - | 240 | 245 |
power supply | - | 3/5 V | 3/5 V |
Certification status | - | Not Qualified | Not Qualified |
Maximum seat height | - | 0.8 mm | 0.8 mm |
Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | - | 1.8 V | 1.8 V |
Nominal supply voltage (Vsup) | - | 3 V | 3 V |
surface mount | - | YES | YES |
Maximum disconnect time | - | 20 ns | 20 ns |
Maximum connection time | - | 35 ns | 35 ns |
switch | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | - | CMOS | CMOS |
Temperature level | - | INDUSTRIAL | INDUSTRIAL |
Terminal surface | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
Terminal form | - | NO LEAD | NO LEAD |
Terminal pitch | - | 0.65 mm | 0.5 mm |
Terminal location | - | QUAD | QUAD |
Maximum time at peak reflow temperature | - | 20 | NOT SPECIFIED |
width | - | 4 mm | 3 mm |