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AWB7223RM52P8

Description
Narrow Band Medium Power Amplifier, 1930MHz Min, 1990MHz Max, 7 X 7 MM, 1.30 MM HEIGHT, ROHS COMPLIANT, MINIATURE, M52, 14 PIN
CategoryWireless rf/communication    Radio frequency and microwave   
File Size654KB,9 Pages
ManufacturerII-VI Incorporated
Environmental Compliance
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AWB7223RM52P8 Overview

Narrow Band Medium Power Amplifier, 1930MHz Min, 1990MHz Max, 7 X 7 MM, 1.30 MM HEIGHT, ROHS COMPLIANT, MINIATURE, M52, 14 PIN

AWB7223RM52P8 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerII-VI Incorporated
package instruction7 X 7 MM, 1.30 MM HEIGHT, ROHS COMPLIANT, MINIATURE, M52, 14 PIN
Reach Compliance Codeunknown
Characteristic impedance50 Ω
structureCOMPONENT
Gain29 dB
Maximum operating frequency1990 MHz
Minimum operating frequency1930 MHz
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
RF/Microwave Device TypesNARROW BAND MEDIUM POWER
Maximum voltage standing wave ratio10
1.930 -1.995 GHz
Small-Cell Power Amplifier Module
FEATURES
InGaP HBT Technology
-50 dBc ACPR @
65
MHz, +27 dBm
29 dB Gain
High Efficiency
Low Transistor Junction Temperature
Matched for a 50
System
Low Profile Miniature Surface Mount Package;
RoHS Compliant
Multi-Carrier Capability
AWB7223
DATA SHEET - Rev 2.0
APPLICATIONS
WCDMA, HSDPA and LTE Air Interfaces
Picocell, Femtocell, Home Nodes
Customer Premises Equipment (CPE)
Data Cards and Terminals
M52 Package
14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION
The AWB7223 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Its high
linearity and efficiency meet the extremely demanding
needs of small cell infrastructure architectures.
Designed for WCDMA, HSDPA, and LTE air interfaces
operating in the 1.930 GHz to 1.995 GHz band, the
AWB7223 delivers up to +27 dBm of WCDMA (64
DPCH) power with an ACPR better than -50 dBc. It
Vcc 1
operates from a convenient +4.5 V supply and provides
29 dB of gain. The device is manufactured using an
advanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. The self-contained 7 mm x 7 mm x 1.3
mm surface mount package incorporates RF matching
networks optimized for output power, efficiency, and
linearity in a 50 Ω system.
Vcc 2
RF Input
Matching
Network
Matching
Network
Bias
Network
Matching
Network
Matching
Network
RF Output
Bias
Network
Power
Detector
V
REF
V
DET
Figure 1: Block Diagram
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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