HDLP11118UMKB-0PC datasheet, PDF

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HDLP11118UMKB-0PC: DescriptionD Type Connector, 118 Contact(s), Male, Solder Terminal,; CategoryThe connector The connector; File Size247KB，6 Pages; ManufacturerHypertronics Corporation

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HDLP11118UMKB-0PC Overview

D Type Connector, 118 Contact(s), Male, Solder Terminal,

HDLP11118UMKB-0PC Parametric

Parameter Name	Attribute value
Maker	Hypertronics Corporation
Reach Compliance Code	unknown
Other features	LOW PROFILE, POLARIZED
Connector type	OTHER D TYPE CONNECTOR
Contact to complete cooperation	GOLD (50) OVER NICKEL
Contact point gender	MALE
DIN compliance	NO
empty shell	NO
Filter function	NO
IEC compliance	NO
MIL compliance	NO
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation type	BOARD
Options	GENERAL PURPOSE
Shell material	LIQUID CRYSTAL POLYMER
Termination type	SOLDER
Total number of contacts	118

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HDLP Series

High Density Low Profile

Connectors

•

High density contact arrangement

Light weight Low profile mated height

Surface mount termination technology

Miniature hyperboloid socket contacts

Interfacial seal

Polarized and scoop proof

Pick and place compatible

General Specifications

Insulator Material

Contact Material

Socket Wire Material

Interfacial Seal Material

Guides Material

Contact Plating

Contact Resistance

Current Rating

Contact Life Cycles

Extraction Forces

Temperature Range

Voltage Rating

Contact Diameter

Liquid crystal polymer (LCP)

Copper alloy

Beryllium copper

Fluorosilicone

Stainless steel

ASTM-488-B

(Type II, grade C, Class 1)

8 milliohms max.

2 Amps per contact

2,000+ operations

1.0 oz.

-55° C to 125° C

110 VDC or AC peak nomial

0.015 [0.39]

Current Rating

The Hypertac

contact design and manufacturing toler-

ances endow the product with the following attributes:

• Double the current rating of other contact designs

of similar size

• Low contact resistance in high current applications

minimizes temperature rise thereby enabling higher

density interconnects

Contact Plating Finishes

Connector Finish

Ordering Code

Description

Component

Socket

Gold Plate

* PLATING THICKNESS

These values apply to mating surfaces.

Component Finish

Ordering Code

-/9

-/7

Conforms To

ASTM-488-B

(Type II, Grade C, Class 1)

ASTM-488-B

(Type II, Grade C, Class 1)

Plating Thickness*

1.27 µm gold plate min.

50 µin gold plate min.

1.27 µm gold plate min.

50 µin gold plate min.

Dimensions are in inches [mm]

www.hypertronics.com

3 / 21

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