SMBus/I2C Interfaced 9-Port, Level-Translating GPIO and LED Driver with CLA
MAX7302_0712 | MAX7302AEE+ | MAX7302ATE+ | |
---|---|---|---|
Description | SMBus/I2C Interfaced 9-Port, Level-Translating GPIO and LED Driver with CLA | SMBus/I2C Interfaced 9-Port, Level-Translating GPIO and LED Driver with CLA | SMBus/I2C Interfaced 9-Port, Level-Translating GPIO and LED Driver with CLA |
Is it lead-free? | - | Lead free | Lead free |
Is it Rohs certified? | - | conform to | conform to |
Maker | - | Maxim | Maxim |
Parts packaging code | - | SSOP | QFN |
package instruction | - | SSOP, | HVQCCN, |
Contacts | - | 16 | 16 |
Reach Compliance Code | - | compli | compli |
ECCN code | - | EAR99 | EAR99 |
Interface integrated circuit type | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
JESD-30 code | - | R-PDSO-G16 | S-XQCC-N16 |
JESD-609 code | - | e3 | e3 |
length | - | 4.89 mm | 3 mm |
Humidity sensitivity level | - | 1 | 1 |
Number of functions | - | 1 | 1 |
Number of terminals | - | 16 | 16 |
Maximum operating temperature | - | 125 °C | 125 °C |
Minimum operating temperature | - | -40 °C | -40 °C |
Package body material | - | PLASTIC/EPOXY | UNSPECIFIED |
encapsulated code | - | SSOP | HVQCCN |
Package shape | - | RECTANGULAR | SQUARE |
Package form | - | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | - | 260 | 260 |
Certification status | - | Not Qualified | Not Qualified |
Maximum seat height | - | 1.75 mm | 0.8 mm |
Maximum supply voltage | - | 3.6 V | 3.6 V |
Minimum supply voltage | - | 1.62 V | 1.62 V |
Nominal supply voltage | - | 3.3 V | 3.3 V |
surface mount | - | YES | YES |
technology | - | BICMOS | BICMOS |
Temperature level | - | AUTOMOTIVE | AUTOMOTIVE |
Terminal surface | - | Matte Tin (Sn) | Matte Tin (Sn) |
Terminal form | - | GULL WING | NO LEAD |
Terminal pitch | - | 0.635 mm | 0.5 mm |
Terminal location | - | DUAL | QUAD |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |
width | - | 3.9 mm | 3 mm |