Ordering number : ENA1926
LV8762T
Overview
Bi-CMOS LSI
Forward/Reverse H-bridge Driver
The LV8762T is an 1ch H-bridge driver that can control four operation modes (forward, reverse, brake, and standby) of a
motor. The IC is optimal for use in driving brushed DC motors for office equipment.
Features
•
Forward/reverse H-bridge motor driver: 1 channel
•
IOmax = 1A
•
Built-in current limiter
•
Current limit mask function
•
Built-in thermal protection circuit
•
Alert signal output
•
Single power supply
•
Built-in short-circuit protection function (selectable from latch-type or auto reset-type).
Specifications
Absolute Maximum Ratings
at Ta = 25°C
Parameter
Supply voltage
Output peak current
Output continuous current
Logic input voltage
EMO pin input voltage
Allowable power dissipation
Operating temperature
Storage temperature
Symbol
VM max
IO peak
IO max
VIN max
VEMO
Pd max
Topr
Tstg
Mounted on a specified board. *
tw
≤
10ms, duty 20%
Conditions
Ratings
36
1.5
1.0
-0.3 to +6
-0.3 to +6
1.4
-20 to +85
-55 to +150
Unit
V
A
A
V
V
W
°C
°C
* Specified circuit board : 57mm×57mm×1.6mm, glass epoxy both-type board.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment (home appliances, AV equipment,
communication device, office equipment, industrial equipment etc.). The products mentioned herein shall not be
intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace
instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety
equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case
of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee
thereof. If you should intend to use our products for applications outside the standard applications of our
customer who is considering such use and/or outside the scope of our intended standard applications, please
consult with us prior to the intended use. If there is no consultation or inquiry before the intended use, our
customer shall be solely responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer
'
s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer
'
s products or
equipment.
20911 SY 20110131-S00005 No.A1926-1/13
LV8762T
Allowable Operating Ratings
at Ta = 25°C
Parameter
Supply voltage range
VREF input voltage
Logic input voltage
Symbol
VM
VREF
VIN
Conditions
Ratings
9 to 32
0 to 3
0 to 5.5
Unit
V
V
V
Electrical Characteristics
at Ta = 25°C, VM = 24V, VREF = 1.5V
Parameter
General
Standby mode current drain
Operating mode current drain
REG5 output voltage
Thermal shutdown temperature
Thermal hysteresis width
Output block
Output on resistance
RonU
RonD
Output leakage current
Diode forward voltage
Rising time
Falling time
Input output delay time
IOleak
VD
tr
tf
tpLH
tpHL
Control system input block
Logic pin input H-level voltage
Logic pin input L-level voltage
Logic pin input current 1
VINH
VINL
IINL
IINH
VREF input current
Current limit comparator
threshold voltage
CHOP pin charge current
CHOP pin threshold voltage
CMK pin charge current
CMK pin threshold voltage
Charge pump block
Step-up voltage
Rising time
Oscillation frequency
Short-circuit protection block
EMO output saturation voltage
SCP pin charge current
Comparator threshold voltage
VEMO
ISCP
VtSCP
IEMO = 1mA
SCP = 0V
-6.5
0.8
-5
1
0.4
-3.5
1.2
V
μA
V
VGH
tONG
Fcp
VM = 24V
VG = 0.1μF
90
27.7
28.7
250
125
29.7
550
155
V
μs
kHz
ICHOP
VtCHOP
ICMK
VtCMK
-6.5
0.8
-32.5
1.2
-5
1
-25
1.5
-3.5
1.2
-17.5
1.8
μA
V
μA
V
IREF
Vtlim
VIN = 0.8V
VIN = 5V
VREF = 1.5V
VREF = 1.5V
4
30
-0.5
0.291
0.3
0.309
8
50
2.0
0.8
12
70
V
V
μA
μA
μA
V
IO = 1A, upper side ON resistance
IO = -1A, under side ON resistance
VO = 32V
ID = -1A
10% to 90%
90% to 10%
IN1 to OUTA, IN2 to OUTB (L
→
H)
IN1 to OUTA, IN2 to OUTB (H
→
L)
1.2
100
100
550
550
0.75
0.5
0.97
0.65
50
1.4
200
200
750
750
Ω
Ω
μA
V
ns
ns
ns
ns
IMst
IM
VREG
TSD
ΔTSD
ST = “L”
ST = “H”, IN1 = “H”, IN2 = “L”, with no load
IO = -1mA
Design guarantee *
Design guarantee *
4.5
150
100
3
5
180
40
400
5
5.5
200
μA
mA
V
°C
°C
Symbol
Conditions
min
Ratings
typ
max
Unit
* Design guarantee value and no measurement is made.
No.A1926-2/13
LV8762T
Package Dimensions
unit : mm (typ)
3260A
6.5
24
13
4.4
6.4
1
0.5
(0.5)
0.22
12
0.15
0.08
(1.0)
1.2max
SANYO : TSSOP24(225mil)
Pin Assignment
0.5
EMM 1
PGND 2
OUTB 3
OUTB 4
RNF 5
RNF 6
VM 7
VM 8
OUTA 9
OUTA 10
NC 11
ST 12
24 EMO
23 CMK
22 SCP
21 CHOP
20 VREF
19 IN2
18 IN1
17 REG5
16 CP1
15 CP2
14 VG
13 GND
Top view
LV8762T
No.A1926-3/13
LV8762T
2.0
Pd max
-
Ta
Allowable power dissipation, Pd max - W
1.5
1.40
1.0
0.73
0.5
0
—
20
0
20
40
60
80
100
Ambient temperature, Ta -
C
Substrate Specifications
(Substrate recommended for operation of LV8762T)
Size
: 57mm × 57mm × 1.6mm (two-layer substrate)
Material
: Glass epoxy both-type board
L1 : Copper wiring pattern diagram
L2 : Copper wiring pattern diagram
Cautions
1) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
2) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
No.A1926-4/13
M
+ -
Block Diagram
CP1 CP2
VG
VM
OUTA
OUTB
RNF
Charge pump
PGND
Output preamplifier stage
Output preamplifier stage
ST
Reference
Voltage
Circuit
REG5
LV8762T
EMO
Oscillation
circuit
Output control
logic
TSD
Brake-Time
Setting Circuit
Current
Limiter
Circuit
Short-circuit
Protection Circuit
Current Limiter
Mask
-
+
-
+
VREF
LVS
GND
No.A1926-5/13
SCP
CHOP
EMM IN1 IN2
CMK
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