SRAM Module, 2MX8, 20ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Electronic Designs Corporation |
package instruction | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
Reach Compliance Code | unknown |
Maximum access time | 20 ns |
Other features | CONFIGURABLE AS 512K X 32 |
I/O type | COMMON |
JESD-30 code | S-CPGA-P66 |
JESD-609 code | e0 |
length | 35.2 mm |
memory density | 16777216 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2MX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Encapsulate equivalent code | PGA66,11X11 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.7 mm |
Maximum standby current | 0.028 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.54 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
width | 35.2 mm |