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WS512K32N-20H2I

Description
SRAM Module, 2MX8, 20ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size403KB,10 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WS512K32N-20H2I Overview

SRAM Module, 2MX8, 20ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WS512K32N-20H2I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time20 ns
Other featuresCONFIGURABLE AS 512K X 32
I/O typeCOMMON
JESD-30 codeS-CPGA-P66
JESD-609 codee0
length35.2 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals66
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height5.7 mm
Maximum standby current0.028 A
Minimum standby current2 V
Maximum slew rate0.54 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
width35.2 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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