AD394SD datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> converter> AD394SD

AD394SD: DescriptionPARALLEL, WORD INPUT LOADING, 10us SETTLING TIME, 12-BIT DAC, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28; CategoryAnalog mixed-signal IC converter; File Size1MB，9 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

Download Datasheet Parametric Compare View All

AD394SD Overview

PARALLEL, WORD INPUT LOADING, 10us SETTLING TIME, 12-BIT DAC, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28

AD394SD Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
Maximum analog output voltage	10 V
Minimum analog output voltage	-10 V
Converter type	D/A CONVERTER
Enter bit code	OFFSET BINARY
Input format	PARALLEL, WORD
JESD-30 code	R-CDIP-T28
JESD-609 code	e0
Maximum linear error (EL)	0.018%
Nominal negative supply voltage	-15 V
Number of digits	12
Number of functions	1
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	COMMERCIAL
Maximum seat height	5.72 mm
Nominal settling time (tstl)	10 µs
Nominal supply voltage	15 V
surface mount	NO
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

AD394SD Related Products

	AD394SD	AD394JD	AD395JD	AD395KD	AD395TD	AD395SD	AD394KD
Description	PARALLEL, WORD INPUT LOADING, 10us SETTLING TIME, 12-BIT DAC, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28	PARALLEL, WORD INPUT LOADING, 10 us SETTLING TIME, 12-BIT DAC, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28	D/A Converter, 1 Func, Parallel, Word Input Loading, 10us Settling Time, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28	D/A Converter, 1 Func, Parallel, Word Input Loading, 10us Settling Time, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28	D/A Converter, 1 Func, Parallel, Word Input Loading, 10us Settling Time, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28	D/A Converter, 1 Func, Parallel, Word Input Loading, 10us Settling Time, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28	PARALLEL, WORD INPUT LOADING, 10us SETTLING TIME, 12-BIT DAC, CDIP28, HYBRID, BOTTOM BRAZED, DOUBLE WIDTH, CERAMIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Contacts	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum analog output voltage	10 V	10 V	-	10 V	10 V	-	10 V
Minimum analog output voltage	-10 V	-10 V	-10 V	-10 V	-10 V	-10 V	-10 V
Converter type	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER
Enter bit code	OFFSET BINARY	OFFSET BINARY	BINARY	BINARY	BINARY	BINARY	OFFSET BINARY
Input format	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD
JESD-30 code	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Maximum linear error (EL)	0.018%	0.018%	0.018%	0.012%	0.012%	0.018%	0.012%
Nominal negative supply voltage	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
Number of digits	12	12	12	12	12	12	12
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	COMMERCIAL	COMMERCIAL	Not Qualified	Not Qualified	Not Qualified	Not Qualified	COMMERCIAL
Maximum seat height	5.72 mm	5.72 mm	5.72 mm	5.72 mm	5.72 mm	5.72 mm	5.72 mm
Nominal settling time (tstl)	10 µs	10 µs	10 µs	10 µs	10 µs	10 µs	10 µs
Nominal supply voltage	15 V	15 V	15 V	15 V	15 V	15 V	15 V
surface mount	NO	NO	NO	NO	NO	NO	NO
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	-
Base Number Matches	-	1	1	1	1	1	1
ECCN code	-	-	EAR99	EAR99	3A001.A.2.C	3A001.A.2.C	-
Is Samacsys	-	-	N	N	N	N	-

Recommended Resources

Current status of lithium-ion battery safety technology development

Ruixin GDBT6-BB motor protector typical application circuit

9V nickel-cadmium battery charging circuit diagram

Inductive anti-theft alarm

Simple refrigerator protector circuit

EXB841 test input and output waveform circuit

[ESP32-Audio-Kit Audio Development Board Review] Part 3 play_mp3_control: 1. Prerequisites The premise for implementing the contents of this section is that the official ESP-IDF framework and ESP-ADF framework of Espressif have been successfully compiled. Here we use the es...; wo4fisher RF/Wirelessly

FPGA Design Process: FPGA Design Process...; zxopenljx EE_FPGA Learning Park

Power supply obstacles + power supply SBC selection and pitfalls: Hello everyone, I am an automotive electronics hardware engineer. When selecting a power SBC, you should pay attention to the battery voltage range and then combine it with the test standards to selec...; 你好再见 Power technology

Sharing of key points on the use of ADI passive components: Sharing of key points on the use of ADI passive components...; 勤奋 ADI Reference Circuit

Four design considerations for telematics hardware in connected cars: It may surprise you to learn that a technology that has been around for nearly two decades has paved the way for connected cars. ECall is old fashioned by high-tech standards, but it is now mandatory ...; alan000345 TI Technology Forum

Method of Recognizing Telephone Signal Tone Using Single Chip Microcomputer: This paper introduces a method of using a single chip microcomputer to identify telephone signal tones, which is low in cost, high in reliability and strong in adaptability. When the signal tone frequ...; frozenviolet MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components