SPST, 2 Func, CMOS, CDIP14
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | General Electric Solid State |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Nominal Negative Supply Voltage (Vsup) | -15 V |
normal position | NC |
Number of functions | 2 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
output | SEPARATE OUTPUT |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | +-15 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Nominal supply voltage (Vsup) | 15 V |
surface mount | NO |
switch | BREAK-BEFORE-MAKE |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DG200AK/HR | DG200BA | DG200M/D | DG200AK/883B | DG200AA | DG200AA/883B | |
---|---|---|---|---|---|---|
Description | SPST, 2 Func, CMOS, CDIP14 | SPST, 2 Func, CMOS, MBCY10, | SPST, 2 Func, CMOS | SPST, 2 Func, CMOS, CDIP14, | SPST, 2 Func, CMOS, MBCY10, | SPST, 2 Func, CMOS, MBCY10, |
package instruction | DIP, DIP14,.3 | , CAN10,.23 | , DIE OR CHIP | DIP, DIP14,.3 | , CAN10,.23 | , CAN10,.23 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST |
Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
normal position | NC | NC | NC | NC | NC | NC |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
Maximum operating temperature | 125 °C | 85 °C | 25 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -25 °C | 25 °C | -55 °C | -55 °C | -55 °C |
output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
Encapsulate equivalent code | DIP14,.3 | CAN10,.23 | DIE OR CHIP | DIP14,.3 | CAN10,.23 | CAN10,.23 |
power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | OTHER | OTHER | MILITARY | MILITARY | MILITARY |
Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | incompatible |
Maker | General Electric Solid State | General Electric Solid State | - | General Electric Solid State | General Electric Solid State | General Electric Solid State |
JESD-30 code | R-XDIP-T14 | O-MBCY-W10 | - | R-XDIP-T14 | O-MBCY-W10 | O-MBCY-W10 |
JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
Number of terminals | 14 | 10 | - | 14 | 10 | 10 |
Package body material | CERAMIC | METAL | - | CERAMIC | METAL | METAL |
Package shape | RECTANGULAR | ROUND | - | RECTANGULAR | ROUND | ROUND |
Package form | IN-LINE | CYLINDRICAL | - | IN-LINE | CYLINDRICAL | CYLINDRICAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | WIRE | - | THROUGH-HOLE | WIRE | WIRE |
Terminal location | DUAL | BOTTOM | - | DUAL | BOTTOM | BOTTOM |