NM93C86EM8 datasheet, PDF - EEWORLD Datasheet

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NM93C86EM8: DescriptionIC,SERIAL EEPROM,1KX16,CMOS,SOP,8PIN,PLASTIC; Categorystorage storage; File Size158KB，12 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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NM93C86EM8 Overview

IC,SERIAL EEPROM,1KX16,CMOS,SOP,8PIN,PLASTIC

NM93C86EM8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	SOP, SOP8,.25
Reach Compliance Code	unknown
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	EEPROM
memory width	16
Number of terminals	8
word count	1024 words
character code	1000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1KX16
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
power supply	5 V
Certification status	Not Qualified
Serial bus type	MICROWIRE
Maximum standby current	0.00005 A
Maximum slew rate	0.001 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
write protect	SOFTWARE

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Description	IC,SERIAL EEPROM,1KX16,CMOS,SOP,8PIN,PLASTIC	IC 2K X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8, Programmable ROM	IC 2K X 8 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Programmable ROM	IC,SERIAL EEPROM,1KX16,CMOS,DIP,8PIN,PLASTIC	IC,SERIAL EEPROM,1KX16,CMOS,SOP,8PIN,PLASTIC	IC,SERIAL EEPROM,1KX16,CMOS,SOP,8PIN,PLASTIC	IC,SERIAL EEPROM,1KX16,CMOS,DIP,8PIN,PLASTIC	IC,SERIAL EEPROM,1KX16,CMOS,DIP,8PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3	DIP, DIP8,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Data retention time - minimum	40	40	40	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDIP-T8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	16	8	8	16	16	16	16	16
Number of terminals	8	8	8	8	8	8	8	8
word count	1024 words	2048 words	2048 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	2000	2000	1000	1000	1000	1000	1000
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	70 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-	-55 °C	-55 °C	-
organize	1KX16	2KX8	2KX8	1KX16	1KX16	1KX16	1KX16	1KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	DIP	SOP	SOP	DIP	DIP
Encapsulate equivalent code	SOP8,.25	SOP8,.25	DIP8,.3	DIP8,.3	SOP8,.25	SOP8,.25	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.001 mA	0.003 mA	0.003 mA	0.001 mA	0.001 mA	0.001 mA	0.001 mA	0.001 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
write protect	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE

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