IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | SOP, SOP16,.25 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.004 A |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP16,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 72 ns |
Certification status | Not Qualified |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
MC74HC137D | 54HC137M/B2CJC | MC74HC137DS | |
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Description | IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC | IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,LLCC,20PIN,CERAMIC | IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | NXP | NXP | NXP |
package instruction | SOP, SOP16,.25 | QCCN, LCC20,.35SQ | SOP, SOP16,.25 |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 code | R-PDSO-G16 | S-XQCC-N20 | R-PDSO-G16 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
Number of functions | 1 | 1 | 1 |
Number of terminals | 16 | 20 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 85 °C |
Minimum operating temperature | -55 °C | -55 °C | -40 °C |
Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | SOP | QCCN | SOP |
Encapsulate equivalent code | SOP16,.25 | LCC20,.35SQ | SOP16,.25 |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE |
power supply | 2/6 V | 2/6 V | 2/6 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | NO LEAD | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL |
Load capacitance (CL) | 50 pF | - | 50 pF |
MaximumI(ol) | 0.004 A | - | 0.004 A |
Prop。Delay @ Nom-Sup | 72 ns | - | 63 ns |