EDJ1108BFBG-AE-F datasheet, PDF

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EDJ1108BFBG-AE-F: Description1G bits DDR3 SDRAM; Categorystorage storage; File Size2MB，147 Pages; ManufacturerELPIDA; Websitehttp://www.elpida.com/en

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EDJ1108BFBG-AE-F Overview

1G bits DDR3 SDRAM

EDJ1108BFBG-AE-F Parametric

Parameter Name	Attribute value
Maker	ELPIDA
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	78
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Maximum access time	0.3 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B78
JESD-609 code	e1
length	10.6 mm
memory density	1073741824 bi
Memory IC Type	DDR DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	78
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	128MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.2 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	7.5 mm

EDJ1108BFBG-AE-F Related Products

	EDJ1108BFBG-AE-F	EDJ1104BFBG	EDJ1104BFBG-AE-F	EDJ1104BFBG-DJ-F	EDJ1104BFBG-GL-F	EDJ1104BFBG-GN-F	EDJ1108BFBG-GN-F
Description	1G bits DDR3 SDRAM	1G bits DDR3 SDRAM	1G bits DDR3 SDRAM	1G bits DDR3 SDRAM	1G bits DDR3 SDRAM	1G bits DDR3 SDRAM	1G bits DDR3 SDRAM
Maker	ELPIDA	-	ELPIDA	ELPIDA	ELPIDA	ELPIDA	ELPIDA
Parts packaging code	BGA	-	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA,	-	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,
Contacts	78	-	78	78	78	78	78
Reach Compliance Code	unknow	-	unknown	unknow	unknown	unknow	unknow
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	MULTI BANK PAGE BURST	-	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Maximum access time	0.3 ns	-	0.3 ns	0.255 ns	0.225 ns	0.225 ns	0.225 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B78	-	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78
JESD-609 code	e1	-	e1	e1	e1	e1	e1
length	10.6 mm	-	10.6 mm	10.6 mm	10.6 mm	10.6 mm	10.6 mm
memory density	1073741824 bi	-	1073741824 bit	1073741824 bi	1073741824 bit	1073741824 bi	1073741824 bi
Memory IC Type	DDR DRAM	-	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	8	-	4	4	4	4	8
Number of functions	1	-	1	1	1	1	1
Number of ports	1	-	1	1	1	1	1
Number of terminals	78	-	78	78	78	78	78
word count	134217728 words	-	268435456 words	268435456 words	268435456 words	268435456 words	134217728 words
character code	128000000	-	256000000	256000000	256000000	256000000	128000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C
organize	128MX8	-	256MX4	256MX4	256MX4	256MX4	128MX8
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	-	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.575 V	-	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	-	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	YES	-	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	-	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	-	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	7.5 mm	-	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm

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