Standard SRAM, 128KX8, 70ns, CMOS, PBGA36, MINI, BGA-36
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | BGA |
| package instruction | MINI, BGA-36 |
| Contacts | 36 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 70 ns |
| JESD-30 code | R-PBGA-B36 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 36 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 2.7 V |
| Minimum supply voltage (Vsup) | 2.3 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
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