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MC14527BCPDS

Description
IC,RATE MULTIPLIER,CMOS,DIP,16PIN,PLASTIC
Categorylogic    logic   
File Size827KB,12 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC14527BCPDS Overview

IC,RATE MULTIPLIER,CMOS,DIP,16PIN,PLASTIC

MC14527BCPDS Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Load/preset inputYES
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MC14527BCPDS Related Products

MC14527BCPDS MC14527BDWR2 MC14527BCPD
Description IC,RATE MULTIPLIER,CMOS,DIP,16PIN,PLASTIC IC,RATE MULTIPLIER,CMOS,SOP,16PIN,PLASTIC IC,RATE MULTIPLIER,CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible
Maker NXP NXP NXP
package instruction DIP, DIP16,.3 SOP, SOP16,.4 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown
JESD-30 code R-PDIP-T16 R-PDSO-G16 R-PDIP-T16
JESD-609 code e0 e0 e0
Load/preset input YES YES YES
Number of terminals 16 16 16
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP
Encapsulate equivalent code DIP16,.3 SOP16,.4 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V
surface mount NO YES NO
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL

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