Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | DIMM |
package instruction | DIMM, DIMM168 |
Contacts | 168 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | SINGLE BANK PAGE BURST |
Maximum access time | 6 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 100 MHz |
I/O type | COMMON |
JESD-30 code | R-XDMA-N168 |
memory density | 1207959552 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 72 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 168 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16MX72 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM168 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
self refresh | YES |
Maximum standby current | 0.018 A |
Maximum slew rate | 1.71 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
M374S1723DTS-L1H | M374S1723DTS-C1H | M374S1723DTS-C7A | M374S1723DTS-L7A | M374S1723DTS-L7C | M374S1723DTS-C7C | M374S1723DTS-C1L | M374S1723DTS-L1L | |
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Description | Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
package instruction | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
Contacts | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compli | compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
Maximum access time | 6 ns | 6 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 6 ns | 6 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 100 MHz | 100 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz | 100 MHz |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
memory density | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bi | 1207959552 bi |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
word count | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
character code | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
self refresh | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum standby current | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A |
Maximum slew rate | 1.71 mA | 1.71 mA | 1.8 mA | 1.8 mA | 1.98 mA | 1.98 mA | 1.71 mA | 1.71 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |