LS SERIES, 10-INPUT AND-OR-INVERT GATE, PQCC20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
package instruction | QCCJ, |
Reach Compliance Code | unknown |
Other features | 2-3-3-2 INPUT |
series | LS |
JESD-30 code | S-PQCC-J20 |
JESD-609 code | e0 |
length | 8.9662 mm |
Logic integrated circuit type | AND-OR-INVERT GATE |
Number of functions | 1 |
Number of entries | 10 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
propagation delay (tpd) | 20 ns |
Certification status | COMMERCIAL |
Maximum seat height | 4.57 mm |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8.9662 mm |
SN74LS54FN | MTMM-150-11-T-Q-473 | SN54LS54W | SN74H54N | SN54L54J | SN5454W | SN54H54W | SNJ54H54W | |
---|---|---|---|---|---|---|---|---|
Description | LS SERIES, 10-INPUT AND-OR-INVERT GATE, PQCC20 | Board Stacking Connector, 200 Contact(s), 4 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT | AND-OR-Invert Gate, LS Series, 1-Func, 10-Input, TTL, CDFP14, CERAMIC, FP-14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 9-Input, TTL, PDIP14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 10-Input, TTL, CDIP14 | TTL/H/L SERIES, 8-INPUT AND-OR-INVERT GATE, CDFP14, CERAMIC, FP-14 | TTL/H/L SERIES, 9-INPUT AND-OR-INVERT GATE, CDFP14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 9-Input, TTL, CDFP14, HERMETIC SEALED, CERAMIC, FP-14 |
Is it lead-free? | Contains lead | Lead free | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | conform to | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | QCCJ, | ROHS COMPLIANT | DFP, | DIP, | DIP, | DFP, | DFP, | HERMETIC SEALED, CERAMIC, FP-14 |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown | unknown | unknown |
Other features | 2-3-3-2 INPUT | FLEXYZ | 2-3-3-2 INPUT | 2-2-3-2 INPUT | 2-3-3-2 INPUT | 2-2-2-2 INPUT; CENTER PIN VCC AND GND | 2-2-3-2 INPUT; CENTER PIN VCC AND GND | 2-2-3-2 INPUT; CENTER PIN VCC AND GND |
JESD-609 code | e0 | e3 | e0 | e0 | e0 | e0 | e0 | e0 |
Terminal pitch | 1.27 mm | 2 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Maker | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
series | LS | - | LS | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
JESD-30 code | S-PQCC-J20 | - | R-GDFP-F14 | R-PDIP-T14 | R-GDIP-T14 | R-GDFP-F14 | R-GDFP-F14 | R-GDFP-F14 |
length | 8.9662 mm | - | 9.21 mm | 19.305 mm | 19.56 mm | 9.21 mm | 9.21 mm | 8.725 mm |
Logic integrated circuit type | AND-OR-INVERT GATE | - | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
Number of entries | 10 | - | 10 | 9 | 10 | 8 | 9 | 9 |
Number of terminals | 20 | - | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 70 °C | - | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | - | - | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | QCCJ | - | DFP | DIP | DIP | DFP | DFP | DFP |
Package shape | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | - | FLATPACK | IN-LINE | IN-LINE | FLATPACK | FLATPACK | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
propagation delay (tpd) | 20 ns | - | 20 ns | 11 ns | 60 ns | 15 ns | 11 ns | 11 ns |
Certification status | COMMERCIAL | - | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified |
Maximum seat height | 4.57 mm | - | 2.03 mm | 5.08 mm | 5.08 mm | 2.03 mm | 2.03 mm | 2.03 mm |
Maximum supply voltage (Vsup) | 5.25 V | - | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.75 V | - | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | - | YES | NO | NO | YES | YES | YES |
technology | TTL | - | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | - | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | TIN LEAD | - | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | J BEND | - | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | FLAT |
Terminal location | QUAD | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 8.9662 mm | - | 6.29 mm | 7.62 mm | 7.62 mm | 6.29 mm | 6.29 mm | 6.35 mm |