CY10E301-3LC datasheet, PDF - EEWORLD Datasheet

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CY10E301-3LC: DescriptionOT PLD, 3ns, PAL-Type, ECL10K, CQCC28; CategoryProgrammable logic devices Programmable logic; File Size237KB，5 Pages; ManufacturerCypress Semiconductor

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CY10E301-3LC Overview

OT PLD, 3ns, PAL-Type, ECL10K, CQCC28

CY10E301-3LC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Reach Compliance Code	not_compliant
Architecture	PAL-TYPE
JESD-30 code	S-XQCC-N28
JESD-609 code	e0
Number of entries	16
Output times	8
Number of product terms	64
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature
Output function	COMBINATORIAL
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	-5.2 V
Programmable logic type	OT PLD
propagation delay	3 ns
Certification status	Not Qualified
surface mount	YES
technology	ECL10K
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD

CY10E301-3LC Related Products

	CY10E301-3LC	CY10E301-3DC	CY10E301-4LC	CY100E301-3LC	CY100E301-4LC
Description	OT PLD, 3ns, PAL-Type, ECL10K, CQCC28	OT PLD, 3ns, PAL-Type, ECL10K, CDIP24	OT PLD, 4ns, PAL-Type, ECL10K, CQCC28	OT PLD, 3ns, PAL-Type, ECL100K, CQCC28	OT PLD, 4ns, PAL-Type, ECL100K, CQCC28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Reach Compliance Code	not_compliant	not_compliant	not_compliant	_compli	_compli
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
JESD-30 code	S-XQCC-N28	R-XDIP-T24	S-XQCC-N28	S-XQCC-N28	S-XQCC-N28
JESD-609 code	e0	e0	e0	e0	e0
Number of entries	16	16	16	16	16
Output times	8	8	8	8	8
Number of product terms	64	64	64	64	64
Number of terminals	28	24	28	28	28
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	85 °C
Output function	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	DIP	QCCN	QCCN	QCCN
Encapsulate equivalent code	LCC28,.45SQ	DIP24,.3	LCC28,.45SQ	LCC28,.45SQ	LCC28,.45SQ
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	-5.2 V	-5.2 V	-5.2 V	-4.5 V	-4.5 V
Programmable logic type	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD
propagation delay	3 ns	3 ns	4 ns	3 ns	4 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	NO	YES	YES	YES
technology	ECL10K	ECL10K	ECL10K	ECL100K	ECL100K
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	QUAD	QUAD	QUAD

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