|
TMS320C6722RFP225 |
TMS320C6726RFP225 |
TMS320C6727BGDH275 |
Description |
Floating-Point Digital Signal Processor 144-HTQFP |
Floating-Point Digital Signal Processor 144-HTQFP |
32-BIT, 25MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1.00 MM PITCH, PLASTIC, BGA-256 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
package instruction |
HTFQFP, |
HTFQFP, |
BGA, BGA256,16X16,40 |
Reach Compliance Code |
unknown |
unknown |
not_compliant |
Address bus width |
13 |
13 |
32 |
barrel shifter |
NO |
NO |
NO |
boundary scan |
YES |
YES |
YES |
maximum clock frequency |
25 MHz |
25 MHz |
25 MHz |
External data bus width |
32 |
32 |
32 |
Format |
FIXED POINT |
FIXED POINT |
FLOATING POINT |
Internal bus architecture |
MULTIPLE |
MULTIPLE |
MULTIPLE |
JESD-30 code |
S-PQFP-G144 |
S-PQFP-G144 |
S-PBGA-B256 |
length |
20 mm |
20 mm |
17 mm |
low power mode |
NO |
NO |
NO |
Number of terminals |
144 |
144 |
256 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HTFQFP |
HTFQFP |
BGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
Package form |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
GRID ARRAY |
Maximum seat height |
1.2 mm |
1.2 mm |
2.02 mm |
Maximum supply voltage |
1.32 V |
1.32 V |
1.32 V |
Minimum supply voltage |
1.14 V |
1.14 V |
1.14 V |
Nominal supply voltage |
1.2 V |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Terminal form |
GULL WING |
GULL WING |
BALL |
Terminal pitch |
0.5 mm |
0.5 mm |
1 mm |
Terminal location |
QUAD |
QUAD |
BOTTOM |
width |
20 mm |
20 mm |
17 mm |
uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
Brand Name |
Texas Instruments |
Texas Instruments |
- |
Maximum operating temperature |
90 °C |
90 °C |
- |
Temperature level |
OTHER |
OTHER |
- |