EE PLD, 14.5ns, 128-Cell, CMOS, PQFP100,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
Reach Compliance Code | unknown |
Other features | YES |
In-system programmable | YES |
JESD-30 code | S-PQFP-G100 |
JESD-609 code | e0 |
JTAG BST | YES |
Number of macro cells | 128 |
Number of terminals | 100 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | TQFP100,.63SQ |
Package shape | SQUARE |
Package form | FLATPACK |
power supply | 3.3 V |
Programmable logic type | EE PLD |
propagation delay | 14.5 ns |
Certification status | Not Qualified |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
PZ3128-S12BP | PZ3128IS15BE | PZ3128IS15BB2 | PZ3128-S12BE | PZ3128-S15BB2 | |
---|---|---|---|---|---|
Description | EE PLD, 14.5ns, 128-Cell, CMOS, PQFP100, | EE PLD, 17.5ns, 128-Cell, CMOS, PQFP128, | EE PLD, 17.5ns, 128-Cell, CMOS, PQFP160, | EE PLD, 14.5ns, 128-Cell, CMOS, PQFP128, | EE PLD, 17.5ns, 128-Cell, CMOS, PQFP160, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Other features | YES | YES | YES | YES | YES |
In-system programmable | YES | YES | YES | YES | YES |
JESD-30 code | S-PQFP-G100 | R-PQFP-G128 | S-PQFP-G160 | R-PQFP-G128 | S-PQFP-G160 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
JTAG BST | YES | YES | YES | YES | YES |
Number of macro cells | 128 | 128 | 128 | 128 | 128 |
Number of terminals | 100 | 128 | 160 | 128 | 160 |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP | QFP | QFP | QFP |
Encapsulate equivalent code | TQFP100,.63SQ | QFP128,.63X.87,20 | QFP160,1.2SQ | QFP128,.63X.87,20 | QFP160,1.2SQ |
Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Programmable logic type | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
propagation delay | 14.5 ns | 17.5 ns | 17.5 ns | 14.5 ns | 17.5 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
package instruction | - | QFP, QFP128,.63X.87,20 | QFP, QFP160,1.2SQ | QFP, QFP128,.63X.87,20 | QFP, QFP160,1.2SQ |