ZBT SRAM, 256KX18, 4.2ns, CMOS, PBGA165
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Reach Compliance Code | not_compliant |
Maximum access time | 4.2 ns |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B165 |
JESD-609 code | e0 |
memory density | 4718592 bit |
Memory IC Type | ZBT SRAM |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of terminals | 165 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA165,11X15,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.04 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.3 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |