Field Programmable Gate Array, 270000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Altera (Intel) |
package instruction | BGA, BGA1152,34X34,40 |
Reach Compliance Code | compliant |
Samacsys Description | FPGA - Field Programmable Gate Array Arria 10 GX 270 FPGA |
JESD-30 code | S-PBGA-B1152 |
length | 35 mm |
Number of entries | 384 |
Number of logical units | 270000 |
Output times | 384 |
Number of terminals | 1152 |
Maximum operating temperature | 100 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA1152,34X34,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 0.9 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 3.65 mm |
Maximum supply voltage | 0.93 V |
Minimum supply voltage | 0.87 V |
Nominal supply voltage | 0.9 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 35 mm |
10AX027H4F34I3SG | 10AX016E4F29I3SG | 10AX048K2F35I2LG | |
---|---|---|---|
Description | Field Programmable Gate Array, 270000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | Field Programmable Gate Array, 160000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | Field Programmable Gate Array, 480000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 |
Is it Rohs certified? | conform to | conform to | conform to |
Maker | Altera (Intel) | Altera (Intel) | Altera (Intel) |
package instruction | BGA, BGA1152,34X34,40 | BGA, BGA780,28X28,40 | BGA, BGA1152,34X34,40 |
Reach Compliance Code | compliant | compli | compli |
JESD-30 code | S-PBGA-B1152 | S-PBGA-B780 | S-PBGA-B1152 |
length | 35 mm | 29 mm | 35 mm |
Number of entries | 384 | 288 | 396 |
Number of logical units | 270000 | 160000 | 480000 |
Output times | 384 | 288 | 396 |
Number of terminals | 1152 | 780 | 1152 |
Maximum operating temperature | 100 °C | 100 °C | 100 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA |
Encapsulate equivalent code | BGA1152,34X34,40 | BGA780,28X28,40 | BGA1152,34X34,40 |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 0.9 V | 0.9 V | 0.9 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.65 mm | 3.35 mm | 3.5 mm |
Maximum supply voltage | 0.93 V | 0.93 V | 0.93 V |
Minimum supply voltage | 0.87 V | 0.87 V | 0.87 V |
Nominal supply voltage | 0.9 V | 0.9 V | 0.9 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 35 mm | 29 mm | 35 mm |