Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, DIMM-168
Parameter Name | Attribute value |
Maker | SK Hynix |
Parts packaging code | DIMM |
package instruction | DIMM, |
Contacts | 168 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | DUAL BANK PAGE BURST |
Maximum access time | 8.5 ns |
Other features | AUTO REFRESH |
JESD-30 code | R-XDMA-N168 |
memory density | 67108864 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 168 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX64 |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | DUAL |
HYM7V64100BTRG-12 | HYM7V64100BLTRG-15 | HYM7V64100BLTRG-12 | HYM7V64100BTRG-15 | HYM7V64100BLTRG-10 | HYM7V64100BTRG-10 | |
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Description | Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, DIMM-168 | Synchronous DRAM Module, 1MX64, 9ns, CMOS, DIMM-168 | Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, DIMM-168 | Synchronous DRAM Module, 1MX64, 9ns, CMOS, DIMM-168 | Synchronous DRAM Module, 1MX64, 8ns, CMOS, DIMM-168 | Synchronous DRAM Module, 1MX64, 8ns, CMOS, DIMM-168 |
Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
package instruction | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, |
Contacts | 168 | 168 | 168 | 168 | 168 | 168 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
Maximum access time | 8.5 ns | 9 ns | 8.5 ns | 9 ns | 8 ns | 8 ns |
Other features | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH |
JESD-30 code | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
memory density | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 64 | 64 | 64 | 64 | 64 | 64 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 168 | 168 | 168 | 168 | 168 | 168 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX64 | 1MX64 | 1MX64 | 1MX64 | 1MX64 | 1MX64 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | SK Hynix | - | - | SK Hynix | SK Hynix | SK Hynix |