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The surge in market demand and tight production capacity in the past two years have prompted major CIS manufacturers to actively respond. Previously, Sony transferred its CIS production capacity ...[Details]
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On April 19, SK Hynix announced that it had signed a memorandum of understanding (MOU) with TSMC to advance the development of HBM4 and next-generation packaging technology, with the goal of puttin...[Details]
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Officials from multiple departments of the U.S. government are planning to impose new restrictions on Huawei, requiring foreign companies that use U.S. chip manufacturing equipment to obtain a U....[Details]
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According to foreign media reports on March 27, chip manufacturer SK Hynix has moved its global sales and marketing team (known as GSM within the company) from Incheon to Seoul. Sources said SK Hyn...[Details]
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Beijing time, June 4 morning news, according to reports, the chief economist of Natixis Asia Pacific said that the global chip shortage is plaguing multiple industries and has shown no signs of easin...[Details]
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Recently, Changdian Technology's subsidiaries Jiangyin Changdian Advanced Packaging Co., Ltd. (hereinafter referred to as "Changdian Advanced") and STATS ChipPAC Korea Co., Ltd. (hereinafter referred...[Details]
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Taiwan Semiconductor Manufacturing Co (TSMC) on Thursday forecast a 10% drop in sales in 2023 after reporting a 23% drop in second-quarter profit as global economic woes dented demand for chips acros...[Details]
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On June 30, 2023, the completion and commissioning ceremony of Xiamen Romo Electronic Technology Co., Ltd., the world's first flexible circuit board additive manufacturing mass production demonstrati...[Details]
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NXP recently announced its second quarter 2019 quarterly report, with total revenue of $2.2 billion, down 3% from the same period last year, and operating profit of $157 million, up 15%. "We are opt...[Details]
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On April 2, 2020, ProPlus Electronics Technology Co., Ltd. (hereinafter referred to as "ProPlus Electronics") announced that it has completed a round A financing of several hundred million yuan. This...[Details]
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According to the latest report from the Semiconductor Industry Association (SEMI), the total investment in new wafer fab construction starting in 2020 is expected to reach US$50 billion, an increase ...[Details]
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Samsung Electronics reportedly announced today that it will merge its mobile and consumer electronics divisions to focus on developing its logic chip business. The massive move is the latest sign o...[Details]
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According to Japanese media Industrial News Daily on the 26th, the Japanese government hopes that TSMC and Sony will invest 1 trillion yen (about 9.19 billion US dollars) to build Japan's first 20-na...[Details]
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On November 7, 2019, the Semiconductor Industry Association (SIA) elected Keith Jackson, President, CEO and Chairman of ON Semiconductor, as its 2020 Chairman and Robert Bruggeworth, President, CEO a...[Details]
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According to BusinessKorea, Chinese semiconductor companies are recruiting engineers in South Korea to strengthen the country's semiconductor supply chain in response to US sanctions. A Korean head...[Details]