WED3C7558M-300CC datasheet, PDF

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WED3C7558M-300CC: DescriptionRISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, CGA-255; CategoryThe embedded processor and controller Microcontrollers and processors; File Size354KB，12 Pages; ManufacturerWhite Microelectronics

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WED3C7558M-300CC Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, CGA-255

WED3C7558M-300CC Parametric

Parameter Name	Attribute value
Maker	White Microelectronics
package instruction	CERAMIC, CGA-255
Reach Compliance Code	unknown
Address bus width	32
bit size	32
boundary scan	YES
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	R-CBGA-B255
low power mode	YES
Number of terminals	255
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR
Package form	GRID ARRAY
Certification status	Not Qualified
speed	300 MHz
Maximum supply voltage	2.2 V
Minimum supply voltage	2.1 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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WED3C7558M-300BX

HI-RELIABILITY PRODUCT

RISC Microprocessor Multichip Package

OVERVIEW

The WEDC 755/SSRAM multichip package is targeted for high

performance, space sensitive, low power systems and supports the

following power management features: doze, nap, sleep and dynamic

power management.

The WED3C7558M-300BX multichip package consists of:

• 755 RISC processor

• Dedicated 1MB SSRAM L2 cache, configured as 128Kx72

• 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

• Maximum Core frequency = 300MHz

• Maximum L2 Cache frequency = 150MHz

• Maximum 60x Bus frequency = 66MHz

ADVANCED*

The WED3C7558M-300BX is offered in Commercial (0°C to +70°C),

industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature

ranges and is well suited for embedded applications such as missiles,

aerospace, flight computers, fire control systems and rugged critical

systems.

* This data sheet describes a product that may or may not be under

development, non-qualified, and is subject to change or cancellation without

notice.

FEATURES

Footprint compatible with WED3C750A8M-200BX

Footprint compatible with Motorola MPC745

FIG. 1

Multi-Chip Package Diagram

SSRAM

µP

755

SSRAM

January 2001 Rev. 2

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

WED3C7558M-300CC Related Products

	WED3C7558M-300CC	WED3C7558M-300CI	WED3C7558M-300CM	WED3C7558M-300BC	WED3C7558M-300BM	WED3C7558M-300BI
Description	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, CGA-255	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, CGA-255	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, CGA-255	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, BGA-255
package instruction	CERAMIC, CGA-255	CERAMIC, CGA-255	CERAMIC, CGA-255	CERAMIC, BGA-255	CERAMIC, BGA-255	CERAMIC, BGA-255
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Address bus width	32	32	32	32	32	32
bit size	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES
External data bus width	64	64	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES
JESD-30 code	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255
low power mode	YES	YES	YES	YES	YES	YES
Number of terminals	255	255	255	255	255	255
Maximum operating temperature	70 °C	85 °C	125 °C	70 °C	125 °C	85 °C
Minimum operating temperature	-	-40 °C	-55 °C	-	-55 °C	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	300 MHz	300 MHz	300 MHz	300 MHz	300 MHz	300 MHz
Maximum supply voltage	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V
Minimum supply voltage	2.1 V	2.1 V	2.1 V	2.1 V	2.1 V	2.1 V
Nominal supply voltage	2 V	2 V	2 V	2 V	2 V	2 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	MILITARY	COMMERCIAL	MILITARY	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maker	White Microelectronics	-	White Microelectronics	White Microelectronics	White Microelectronics	White Microelectronics

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