HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | not_compliant |
| series | HC/UH |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.004 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/6 V |
| Prop。Delay @ Nom-Sup | 38 ns |
| propagation delay (tpd) | 38 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Maximum seat height | 5 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| M54HC132F1 | M74HC132F1 | M74HC132B1N | M74HC132C1 | M74HC132M1 | |
|---|---|---|---|---|---|
| Description | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PQCC20, PLASTIC, CC-20 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | DIP | DIP | DIP | QFN | SOIC |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | PLASTIC, CC-20 | MICRO, PLASTIC, GULLWING, DIP-14 |
| Contacts | 14 | 14 | 14 | 20 | 14 |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-GDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | S-PQCC-J20 | R-PDSO-G14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| Number of functions | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 20 | 14 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | QCCJ | SOP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | LDCC20,.4SQ | SOP14,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| propagation delay (tpd) | 38 ns | 31 ns | 31 ns | 31 ns | 31 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | YES | YES | YES | YES | YES |
| Maximum seat height | 5 mm | 5 mm | 5.1 mm | 4.57 mm | 1.75 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 8.9662 mm | 3.9 mm |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | - |
| Prop。Delay @ Nom-Sup | 38 ns | - | 31 ns | 31 ns | 31 ns |
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