IS24C01-3PA datasheet, PDF - EEWORLD Datasheet

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IS24C01-3PA: DescriptionEEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8; Categorystorage storage; File Size54KB，16 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS24C01-3PA Overview

EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8

IS24C01-3PA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIP
package instruction	0.300 INCH, PLASTIC, DIP-8
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.1 MHz
Data retention time - minimum	100
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.325 mm
memory density	1024 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	128 words
character code	128
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	128X8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Serial bus type	I2C
Maximum standby current	0.000004 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE

IS24C01-3PA Related Products

	IS24C01-3PA	IS24C01-3SA	IS24C01-5PA	IS24C01-5GA	IS24C01-3GA	IS24C01-5SA	IS24C01-5ZA
Description	EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8	EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8	EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8	EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8	EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8	EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8	EEPROM, 128X8, Serial, CMOS, PDSO8, TSSOP-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	MSOP	DIP	SOIC	SOIC	MSOP	SOIC
package instruction	0.300 INCH, PLASTIC, DIP-8	TSSOP, TSSOP8,.19	0.300 INCH, PLASTIC, DIP-8	SOIC-8	SOIC-8	MSOP-8	TSSOP-8
Contacts	8	8	8	8	8	8	8
Reach Compliance Code	unknown	not_compliant	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.1 MHz	0.1 MHz	0.4 MHz	0.4 MHz	0.1 MHz	0.4 MHz	0.4 MHz
JESD-30 code	R-PDIP-T8	S-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	9.325 mm	3 mm	9.325 mm	4.9 mm	4.9 mm	3 mm	4.4 mm
memory density	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
word count	128 words	128 words	128 words	128 words	128 words	128 words	128 words
character code	128	128	128	128	128	128	128
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	128X8	128X8	128X8	128X8	128X8	128X8	128X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	DIP	SOP	SOP	TSSOP	TSSOP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	1.1 mm	4.57 mm	1.75 mm	1.75 mm	1.1 mm	1.2 mm
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	4.5 V	4.5 V	2.7 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.65 mm	2.54 mm	1.27 mm	1.27 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	3 mm	7.62 mm	3.9 mm	3.9 mm	3 mm	3 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
Maker	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Is it lead-free?	-	Contains lead	-	Contains lead	Contains lead	-	Contains lead

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