FIFO, 16KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | BGA |
package instruction | BGA, BGA256,16X16,40 |
Contacts | 256 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 3.7 ns |
Maximum clock frequency (fCLK) | 166 MHz |
period time | 6 ns |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
memory density | 589824 bit |
Memory IC Type | OTHER FIFO |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 256 |
word count | 16384 words |
character code | 16000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16KX36 |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
power supply | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 3.5 mm |
Maximum standby current | 0.1 A |
Maximum slew rate | 0.15 mA |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
width | 17 mm |
IDT72P51539L6BB8 | IDT72P51559L6BB8 | IDT72P51549L5BB8 | IDT72P51549L6BB8 | IDT72P51569L5BB8 | IDT72P51539L5BB8 | IDT72P51559L5BB8 | IDT72P51569L6BB8 | |
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Description | FIFO, 16KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 32KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 128KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 16KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 64KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | FIFO, 128KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | BGA, BGA256,16X16,40 | 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 |
Contacts | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 3.7 ns | 3.7 ns | 3.6 ns | 3.7 ns | 3.6 ns | 3.6 ns | 3.6 ns | 3.7 ns |
Maximum clock frequency (fCLK) | 166 MHz | 166 MHz | 200 MHz | 166 MHz | 200 MHz | 200 MHz | 200 MHz | 166 MHz |
period time | 6 ns | 6 ns | 5 ns | 6 ns | 5 ns | 5 ns | 5 ns | 6 ns |
JESD-30 code | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
memory density | 589824 bit | 2359296 bit | 1179648 bit | 1179648 bit | 4718592 bit | 589824 bit | 2359296 bit | 4718592 bit |
Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
memory width | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
word count | 16384 words | 65536 words | 32768 words | 32768 words | 131072 words | 16384 words | 65536 words | 131072 words |
character code | 16000 | 64000 | 32000 | 32000 | 128000 | 16000 | 64000 | 128000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 16KX36 | 64KX36 | 32KX36 | 32KX36 | 128KX36 | 16KX36 | 64KX36 | 128KX36 |
Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Encapsulate equivalent code | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm |
Maximum standby current | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
Maximum slew rate | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA |
Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
width | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |