Bridge Rectifier Diode, 1 Phase, 25A, 400V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | O-MUFM-D1 |
Reach Compliance Code | compliant |
Shell connection | ISOLATED |
Configuration | BRIDGE, 4 ELEMENTS |
Diode component materials | SILICON |
Diode type | BRIDGE RECTIFIER DIODE |
JESD-30 code | O-MUFM-D1 |
JESD-609 code | e0 |
Maximum non-repetitive peak forward current | 150 A |
Number of components | 4 |
Phase | 1 |
Number of terminals | 1 |
Maximum output current | 25 A |
Package body material | METAL |
Package shape | ROUND |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum repetitive peak reverse voltage | 400 V |
surface mount | NO |
Terminal surface | TIN LEAD |
Terminal form | SOLDER LUG |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
MY400XT | MY200XT | MY300XS | MY300XT | MY200XS | MY400XS | |
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Description | Bridge Rectifier Diode, 1 Phase, 25A, 400V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2 | Bridge Rectifier Diode, 1 Phase, 25A, 200V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2 | Bridge Rectifier Diode, 1 Phase, 25A, 300V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2 | Bridge Rectifier Diode, 1 Phase, 25A, 300V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2 | Bridge Rectifier Diode, 1 Phase, 25A, 200V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2 | Bridge Rectifier Diode, 1 Phase, 25A, 400V V(RRM), Silicon, HERMETIC SEALED, GLASS PACAKGE-2 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
package instruction | O-MUFM-D1 | O-MUFM-D1 | O-MUPM-D1 | O-MUFM-D1 | O-MUPM-D1 | O-MUPM-D1 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
Configuration | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS |
Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Diode type | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE |
JESD-30 code | O-MUFM-D1 | O-MUFM-D1 | O-MUPM-D1 | O-MUFM-D1 | O-MUPM-D1 | O-MUPM-D1 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Maximum non-repetitive peak forward current | 150 A | 150 A | 150 A | 150 A | 150 A | 150 A |
Number of components | 4 | 4 | 4 | 4 | 4 | 4 |
Phase | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 1 | 1 | 1 | 1 | 1 | 1 |
Maximum output current | 25 A | 25 A | 25 A | 25 A | 25 A | 25 A |
Package body material | METAL | METAL | METAL | METAL | METAL | METAL |
Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
Package form | FLANGE MOUNT | FLANGE MOUNT | POST/STUD MOUNT | FLANGE MOUNT | POST/STUD MOUNT | POST/STUD MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum repetitive peak reverse voltage | 400 V | 200 V | 300 V | 300 V | 200 V | 400 V |
surface mount | NO | NO | NO | NO | NO | NO |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG |
Terminal location | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | - |