Adder/Subtractor, CMOS, CDIP16,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Aeroflex |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | ADDER/SUBTRACTOR |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
UT54ACTS283-PQAR | UT54ACS283-PQAR | UT54ACTS283-PVAR | UT54ACS283-PQCR | UT54ACS283-PVAR | UT54ACTS283-PQXR | |
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Description | Adder/Subtractor, CMOS, CDIP16, | Adder/Subtractor, CMOS, CDIP16, | Adder/Subtractor, CMOS, CDIP16, | Adder/Subtractor, CMOS, CDIP16, | Adder/Subtractor, CMOS, CDIP16, | Adder/Subtractor, CMOS, CDIP16, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |