Multicore Digital Signal Processor
Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | FBGA, BGA561,27X27,32 |
Contacts | 561 |
Reach Compliance Code | compli |
ECCN code | 3A001.A.3 |
Factory Lead Time | 1 week |
Address bus width | 14 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 625 MHz |
External data bus width | 32 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B561 |
JESD-609 code | e1 |
length | 23 mm |
low power mode | YES |
Humidity sensitivity level | 4 |
Number of terminals | 561 |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA561,27X27,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 1.1,1.8 V |
Certification status | Not Qualified |
RAM (number of words) | 8192 |
Maximum seat height | 3.3 mm |
speed | 850 MHz |
Maximum supply voltage | 1.2 V |
Minimum supply voltage | 0.9 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
TMS320C6474FZUN8 | TMS320C6474FCUN | TMS320C6474FGUN2 | TMS320C6474FGUNA | TMS320C6474FZUN | TMS320C6474FZUN2 | TMS320C6474FZUNA | TMS320C6474FZUNA2 | |
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Description | Multicore Digital Signal Processor | Multicore Digital Signal Processor 561-FC/CSP 0 to 85 | Digital Signal Processors & Controllers - DSP, DSC Multicore Digital Signal Proc | Multicore Digital Signal Processor 561-FCBGA -40 to 100 | Digital Signal Processors & Controllers - DSP, DSC Multicore Dig Signal Processor | Digital Signal Processors & Controllers - DSP, DSC Multicore Dig Signal | Digital Signal Processors & Controllers - DSP, DSC Multicore Dig Signal Processor | Multicore Digital Signal Processor |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 | FBGA, BGA561,27X27,32 |
Reach Compliance Code | compli | compli | _compli | _compli | compli | compli | compli | compli |
ECCN code | 3A001.A.3 | 3A991.A.2 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
Address bus width | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
bit size | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
boundary scan | YES | YES | YES | YES | YES | YES | YES | YES |
maximum clock frequency | 625 MHz | 625 MHz | 625 MHz | 625 MHz | 625 MHz | 625 MHz | 625 MHz | 625 MHz |
External data bus width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Format | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
Integrated cache | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 code | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 |
length | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
low power mode | YES | YES | YES | YES | YES | YES | YES | YES |
Number of terminals | 561 | 561 | 561 | 561 | 561 | 561 | 561 | 561 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
Encapsulate equivalent code | BGA561,27X27,32 | BGA561,27X27,32 | BGA561,27X27,32 | BGA561,27X27,32 | BGA561,27X27,32 | BGA561,27X27,32 | BGA561,27X27,32 | BGA561,27X27,32 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | 245 | 245 | 220 | 220 | NOT SPECIFIED | 245 | 245 | 245 |
power supply | 1.1,1.8 V | 1.1,1.8 V | 1.1,1.8 V | 1.1,1.8 V | 1.1,1.8 V | 1.1,1.8 V | 1.1,1.8 V | 1.1,1.8 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (number of words) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
Maximum seat height | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
speed | 850 MHz | 1000 MHz | 1200 MHz | 1000 MHz | 1000 MHz | 1200 MHz | 1000 MHz | 1200 MHz |
Maximum supply voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Minimum supply voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Nominal supply voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
Is it Rohs certified? | conform to | conform to | incompatible | - | conform to | conform to | conform to | conform to |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments |
Parts packaging code | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA |
Contacts | 561 | - | 561 | 561 | 561 | 561 | 561 | 561 |
Factory Lead Time | 1 week | 6 weeks | - | 1 week | 1 week | - | 1 week | 1 week |
JESD-609 code | e1 | e1 | e0 | e0 | - | e1 | e1 | e1 |
Humidity sensitivity level | 4 | 4 | 4 | 4 | - | 4 | 4 | 4 |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
Is it lead-free? | - | Lead free | Contains lead | - | Contains lead | Contains lead | Contains lead | Lead free |