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TMS320C6474FZUN8

Description
Multicore Digital Signal Processor
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,214 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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TMS320C6474FZUN8 Overview

Multicore Digital Signal Processor

TMS320C6474FZUN8 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionFBGA, BGA561,27X27,32
Contacts561
Reach Compliance Codecompli
ECCN code3A001.A.3
Factory Lead Time1 week
Address bus width14
bit size32
boundary scanYES
maximum clock frequency625 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B561
JESD-609 codee1
length23 mm
low power modeYES
Humidity sensitivity level4
Number of terminals561
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA561,27X27,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)245
power supply1.1,1.8 V
Certification statusNot Qualified
RAM (number of words)8192
Maximum seat height3.3 mm
speed850 MHz
Maximum supply voltage1.2 V
Minimum supply voltage0.9 V
Nominal supply voltage1.1 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width23 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

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Description Multicore Digital Signal Processor Multicore Digital Signal Processor 561-FC/CSP 0 to 85 Digital Signal Processors & Controllers - DSP, DSC Multicore Digital Signal Proc Multicore Digital Signal Processor 561-FCBGA -40 to 100 Digital Signal Processors & Controllers - DSP, DSC Multicore Dig Signal Processor Digital Signal Processors & Controllers - DSP, DSC Multicore Dig Signal Digital Signal Processors & Controllers - DSP, DSC Multicore Dig Signal Processor Multicore Digital Signal Processor
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32 FBGA, BGA561,27X27,32
Reach Compliance Code compli compli _compli _compli compli compli compli compli
ECCN code 3A001.A.3 3A991.A.2 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 14 14 14 14 14 14 14 14
bit size 32 32 32 32 32 32 32 32
boundary scan YES YES YES YES YES YES YES YES
maximum clock frequency 625 MHz 625 MHz 625 MHz 625 MHz 625 MHz 625 MHz 625 MHz 625 MHz
External data bus width 32 32 32 32 32 32 32 32
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES YES YES YES YES
JESD-30 code S-PBGA-B561 S-PBGA-B561 S-PBGA-B561 S-PBGA-B561 S-PBGA-B561 S-PBGA-B561 S-PBGA-B561 S-PBGA-B561
length 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm
low power mode YES YES YES YES YES YES YES YES
Number of terminals 561 561 561 561 561 561 561 561
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
Encapsulate equivalent code BGA561,27X27,32 BGA561,27X27,32 BGA561,27X27,32 BGA561,27X27,32 BGA561,27X27,32 BGA561,27X27,32 BGA561,27X27,32 BGA561,27X27,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 245 245 220 220 NOT SPECIFIED 245 245 245
power supply 1.1,1.8 V 1.1,1.8 V 1.1,1.8 V 1.1,1.8 V 1.1,1.8 V 1.1,1.8 V 1.1,1.8 V 1.1,1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) 8192 8192 8192 8192 8192 8192 8192 8192
Maximum seat height 3.3 mm 3.3 mm 3.3 mm 3.3 mm 3.3 mm 3.3 mm 3.3 mm 3.3 mm
speed 850 MHz 1000 MHz 1200 MHz 1000 MHz 1000 MHz 1200 MHz 1000 MHz 1200 MHz
Maximum supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
Is it Rohs certified? conform to conform to incompatible - conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments
Parts packaging code BGA - BGA BGA BGA BGA BGA BGA
Contacts 561 - 561 561 561 561 561 561
Factory Lead Time 1 week 6 weeks - 1 week 1 week - 1 week 1 week
JESD-609 code e1 e1 e0 e0 - e1 e1 e1
Humidity sensitivity level 4 4 4 4 - 4 4 4
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Is it lead-free? - Lead free Contains lead - Contains lead Contains lead Contains lead Lead free

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