IC,MIXED MEMORY,FLASH+SDRAM,CMOS,BGA,133PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Cypress Semiconductor |
Reach Compliance Code | compliant |
JESD-30 code | S-PBGA-B133 |
Memory IC Type | MEMORY CIRCUIT |
Mixed memory types | FLASH+SDRAM |
Number of terminals | 133 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA133,14X14,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, FINE PITCH |
power supply | 1.8 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |