IDT72V51556L6BB8 datasheet, PDF

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IDT72V51556L6BB8: DescriptionFIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256; Categorystorage storage; File Size545KB，58 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT72V51556L6BB8 Overview

FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72V51556L6BB8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	BGA, BGA256,16X16,40
Contacts	256
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	3.7 ns
Other features	ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
Maximum clock frequency (fCLK)	166 MHz
period time	6 ns
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
length	17 mm
memory density	2359296 bit
Memory IC Type	OTHER FIFO
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	256
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX36
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	3.5 mm
Maximum standby current	0.01 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	17 mm

IDT72V51556L6BB8 Related Products

	IDT72V51556L6BB8	IDT72V51546L7-5BB8	IDT72V51556L7-5BB8	IDT72V51546L6BB8	IDT72V51556L7-5BB
Description	FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40
Contacts	256	256	256	256	256
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	3.7 ns	4 ns	4 ns	3.7 ns	4 ns
Other features	ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT	ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT	ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT	ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT	ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
Maximum clock frequency (fCLK)	166 MHz	133 MHz	133 MHz	166 MHz	133 MHz
period time	6 ns	7.5 ns	7.5 ns	6 ns	7.5 ns
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
JESD-609 code	e0	e0	e0	e0	e0
length	17 mm	17 mm	17 mm	17 mm	17 mm
memory density	2359296 bit	1179648 bit	2359296 bit	1179648 bit	2359296 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	36	36	36	36	36
Humidity sensitivity level	3	3	3	3	3
Number of functions	1	1	1	1	1
Number of terminals	256	256	256	256	256
word count	65536 words	32768 words	65536 words	32768 words	65536 words
character code	64000	32000	64000	32000	64000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	64KX36	32KX36	64KX36	32KX36	64KX36
Exportable	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm
Maximum standby current	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
Maximum slew rate	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA
Maximum supply voltage (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	20	20	20	20
width	17 mm	17 mm	17 mm	17 mm	17 mm

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