Applications Processor 515-POP-FCBGA 0 to 90
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA515,28X28,16 |
| Contacts | 515 |
| Reach Compliance Code | compli |
| JESD-30 code | S-PBGA-B515 |
| JESD-609 code | e1 |
| length | 12 mm |
| Humidity sensitivity level | 3 |
| Number of terminals | 515 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA515,28X28,16 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.1,1.2,1.8,1.8/3 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.9 mm |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.4 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 12 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
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