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QTT-111-03-F-T

Description
Board Stacking Connector, 33 Contact(s), 3 Row(s), Male, Straight, Solder Terminal, Black Insulator, ROHS COMPLIANT
CategoryThe connector    The connector   
File Size554KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance  
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QTT-111-03-F-T Overview

Board Stacking Connector, 33 Contact(s), 3 Row(s), Male, Straight, Solder Terminal, Black Insulator, ROHS COMPLIANT

QTT-111-03-F-T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time2 weeks
Samacsys Description33 position, 2.00 mm Power Plane Terminal Strip
body width0.236 inch
subject depth0.433 inch
body length0.879 inch
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD FLASH OVER NICKEL
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
Contact styleSQ PIN-SKT
DIN complianceNO
Filter functionNO
IEC complianceNO
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee3
MIL complianceNO
Manufacturer's serial numberQTT
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
Number of rows loaded3
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
Plating thicknessFLASH inch
GuidelineUL
reliabilityCOMMERCIAL
Terminal length0.09 inch
Terminal pitch2 mm
Termination typeSOLDER
Total number of contacts33
F-213 SUPPLEMENT
QST–117–02–G–T
(2,00 mm) .0787"
QTT, QST SERIES
QTT–117–04–G–5
POWER PLANE TERMINAL & SOCKET
SPECIFICATIONS
For complete specifications
see www.samtec.com?QTT
or www.samtec.com?QST
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material (QTT):
Phosphor Bronze
Contact Material (QST):
Phosphor Bronze
Current Rating:
3A @ per contact
80°C ambient
Operating Temp Range:
-55°C to +105°C with Tin;
-55°C to +125°C with Gold
Max Processing Temp:
230°C for 60 seconds
Plating:
Sn or Au over 50µ" (1,27 µm) Ni
Insertion Force (QST):
4 oz (1,11 N) avg
Withdrawal Force (QST):
3 oz (0,837 N) avg
Impedance:
50Ω ±5% @ 170 MHz
50Ω ±20% @ 253 MHz
(system @ 50Ω)
RoHS Compliant:
Yes
QTT
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
250
PLATING
OPTION
ROW
OPTION
10 thru 50
(1,00)
.0394
05
–G
= 20µ" (0,51 µm)
Gold on
contact area
Gold flash on tail
–T
= Triple Row
(Row 2 is Ground Plane)
No. of positions x
(2,00) .0787 + (0,25) .010
(No. of positions -1)
x (2,00) .0787
–5
= Five Row
(Rows 2 and 4 are Ground Planes)
–S
LEAD
STYLE
–01
–02
(No. of
rows -1)
x (2,00)
.0787
A
(7,00)
.276
(9,00)
.355
(11,00)
.433
(13,00)
.512
= 30µ" (0,76 µm)
Gold on
contact area,
Tin on tail
–L
= 10µ" (0,25 µm)
Gold on
contact area,
Tin on tail
(10,00)
.394
(6,00)
.236
01
246
–03
–04
(0,50) .020 SQ
(3,04)
.120
(2,00)
.0787
–F
A
(2,29)
.090
APPLICATIONS
QTT
SPACING
QST
= Gold flash
on contact area,
Tin on tail
–5
–T
TYPICAL BOARD SPACING
QTT QST
SPACING
(19,71) .776
–01 –02
(21,72) .855
–02 –02
–03 –03
(27,51) 1.083
–04 –04
(32,31) 1.272
QST
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
–01
PLATING
OPTION
ROW
OPTION
APPLICATION
SPECIFIC OPTION
9A
18A
10 thru 50
250
–G
= 20µ" (0,51 µm)
Gold on contact area,
Gold flash on tail
–T
= Triple Row
(Row 2 is Ground Plane)
No. of positions x
(2,00) .07874 + (0,30) .012
05
–5
–S
= Five Row
(Rows 2 and 4 are Ground Planes)
27A
Mix and
match power
plane and
signal pin
locations
and size.
Call Samtec
for part
number.
A
B
= 30µ" (0,76 µm)
Gold on contact area,
Tin on tail
(16,21) (5,39)
.638 .212
(12,70) (3,18)
.500 .125
(2,29)
(19,30) .090
.760
–L
= 10µ" (0,25 µm)
Gold on contact area,
Tin on tail
246
01
–02
(10,00)
.394
(6,00)
.236
–03
(16,51)
.650
A
–04
–F
= Gold flash on
contact area,
Tin on tail
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0,50) .020 SQ
(2,00)
.07874
B
–5
–T
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