Fuseholders and fuse carriers may be ordered separately.
0709
BU-SB09620
Page 1 of 2
Data Sheet 2119
Dimensions - in (mm)
Terminal Options
Screwdriver Type Carrier
3
Solder/
⁄
16˝
Quick-Connect
Rt. Angle
Carrier Options
1
⁄
4
˝ Quick-Connect
Rt. Angle
⁄
4
˝ x
1
⁄
4
˝
(“I” Equals Inches)
1
Maximum
Panel
Thickness
Common Dimensional Data:
(Screwdriver Slotted)
1.75˝ (44.5mm)
NOTE: Plus In-Line Terminal
0.17"
(4.37mm)
In-Line
In-Line
5 x 20mm
(“M” Equals Metric)
Screwdriver
Screwdriver
0.34"
(8.7mm)
0.33"
(8.3mm)
0.47"
(11.9mm)
0.45"
(11.5mm)
1.58"
(40.03mm)
0.30˝
7.62mm
Low Profile
Rear Hex Nut
0.41"
(10.31mm)
HTB-32I-R
HTB-34I-R
HTB-36I-R
HTB-38I-R
3
—
HTB-3
1.34"
(34.13mm)
HTB-32M-R
HTB-34M-R
HTB-36M-R
HTB-38M-R
—
3
HTB-52I-R
0.125˝
3.18mm
HTB-54I-R
HTB-56I-R
HTB-58I-R
3
—
High Profile
Rear Hex Nut
0.17"
(4.37mm)
HTB-5
1.59"
(40.08mm)
HTB-52M-R
HTB-54M-R
HTB-56M-R
HTB-58M-R
—
3
HTB-92I-R
0.125˝
3.18mm
HTB-94I-R
HTB-96I-R
HTB-98I-R
3
—
Low-Profile
Snap-In
HTB-9
HTB-92M-R
HTB-94M-R
HTB-96M-R
HTB-98M-R
—
3
Fuseholders and fuse carriers may be ordered separately.
Ordering Information
FUSE CARRIER ONLY
HTB-
S
P
Packing
(Blank)
– Std.
BK/
– Bulk
Product
Symbol
Fuse Carrier
I —
1
/
4
˝
x 1
1
/
4
˝
M —
5 x 20mm
Rear Terminal Configuration
2 —
Solder /
3
/
16
˝
Quick-Connect
(In-Line)
4 —
Solder /
3
/
16
˝
Quick-Connect
(Right Angle)
6 —
1
/
4
˝
Quick-Connect (In-Line)
8 —
1
/
4
˝
Quick-Connect (Right Angle)
Splash Proof
Cap with O-Ring
(Optional on Knob
Holders Only)
Body Configuration and Mounting
Knob Holders
2 —
Low Profile (Rear Panel Hex-Nut)
4 —
High Profile
*
6 —
(Front Panel Hex-Nut)
8 —
Low Profile (Snap-In)
Screwdriver Slotted Holders
3 —
Low Profile
5 —
High Profile
9 —
Low Profile (Snap-In)
Packaging
(Blank)
– Std.
BK/
– Bulk
-R
RoHS
Compliant
Product
Symbol
FT —
Knob Type
(For 20, 40, 60,
and 80 Series
Only)
ST —
Screwdriver
Slotted (For 30,
50, and 90 Series
Only)
Fuse Carrier
I —
1
/
4
˝
x
1
1
/
4
˝
M —
5mm x 20mm
*Profile varies with panel thickness. Holder installs thru rear of panel.
Packaging
Packaging Code Prefix
Blank
BK
Description
10 fuse holders packed into a carton
100 fuse holders packed into a cardboard shelf package
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in
# EVB2601 Simple Unboxing## Introduction>RVB2601 is a development board based on the Pingtouge eco chip CH2601, with onboard JTAG debugger, WiFi&BLE chip W800, audio ADCES7210, audio DAC-ES8156, 128x6...
TI Embedded Live Month: In-depth exploration of new applications of embedded products in industry and automobiles. The second session will be live at 14:00 today.Click here to enter the live broadcast...
The embedded world we live in is developed by thousands of different MCUs and CPUs. To support the free flow of data and information, many are interconnected and often without communication. This data...
[Competition Details] 2020-2021 ON Semiconductor and Avnet IoT Creative Design CompetitionThanks again to all the netizens for their understanding and support of this contest!Our board is finally movi...
EEWORLD社区onsemi and Avnet IoT Innovation Design Competition
I have been engaged in PLC programming for a year, and I feel that I have to design a separate program for each device I encounter. Do you have a universal program template that can be applied?...
How big is the imagination space for pressure sensing?
Will said that MEMS pressure sensors are a new interactive method compared to traditional touch. Intuitively speaking, "touch" is an action, and ...
On June 13, Reuters reported that Toshiba's second-largest shareholder demanded the immediate resignation of its chairman and three other directors after an investigation found that the company coll...[Details]
Program optimization refers to the process of adjusting and improving the program using software development tools after software programming is completed, so that the program can make full use of res...[Details]
On October 12, 2021, WPG Holdings, a leading semiconductor component distributor dedicated to the Asia-Pacific market, announced that its subsidiary Usun has launched a digital power solution based...[Details]
During the two sessions of the National People's Congress this year, deputies to the National People's Congress and members of the Chinese People's Political Consultative Conference put forward sugge...[Details]
1. Electronic ballast knowledge
1. Overview:
In the 1970s, there was a global energy crisis. The urgency of energy conservation led many companies to devote themselves to the research of e...[Details]
During the measurement process, a high waveform capture rate is very important for an oscilloscope, as it can improve the oscilloscope's ability to capture random events and low-probability events. ...[Details]
0 Introduction
In modern measurement and control systems, since PCs have powerful data processing capabilities and good user interaction interfaces, and single-chip microcomputers have strong o...[Details]
On December 21, Beijing time, Micron Technology announced its first-quarter financial report, with better performance than Wall Street expected, because data centers and electric vehicles require a l...[Details]
On September 2, IDC's "China Wearable Device Market Quarterly Tracking Report, Q2 2021" showed that China's wearable device market shipments in the second quarter of 2021 were 36.14 million units, a ...[Details]
For intelligent driving, cars collect environmental data through more and more sensors and cameras. In order to analyze this data to identify objects, track their movements and predict their behavi...[Details]
IGBT technology cannot lag behind application requirements. Therefore, Infineon has launched the latest generation of IGBT chips to meet the needs of specific applications. The switching speed and sof...[Details]
Intel and Samsung collaborated to develop the new Galaxy Book Pro series of notebooks, designed to deliver exceptional mobility, connectivity and performance experiences. Digital technology is ...[Details]
Here is a little experience on using oscilloscope probes for your reference. The most important thing is the bandwidth, which is usually written on the probe, how many MHz. If the probe bandwidth is ...[Details]
0 Introduction
With the development of voice services, narrowband and broadband data services in wireless communications, mobile phones with 3G functions will gradually become the mainstre...[Details]
ABB industrial robots are automation equipment widely used in manufacturing, logistics, medical and other fields. Their motion instructions are the key to achieving precise control of the robot. Th...[Details]
XuanTie RISC-V Activity Zone
京公网安备 11010802033920号
EEWORLD
