Telephone Dialer Circuit, CMOS, PDIP24, PLASTIC, DIP-24
Parameter Name | Attribute value |
Maker | Winbond Electronics Corporation |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 24 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e3 |
damage rate | 1:2 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -20 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Nominal supply voltage | 2.5 V |
surface mount | NO |
technology | CMOS |
Telecom integrated circuit types | TELEPHONE DIALER CIRCUIT |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
W91650B | W91651 | W91651B | |
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Description | Telephone Dialer Circuit, CMOS, PDIP24, PLASTIC, DIP-24 | Telephone Dialer Circuit, CMOS, PDIP24, PLASTIC, DIP-24 | Telephone Dialer Circuit, CMOS, PDIP24, PLASTIC, DIP-24 |
Maker | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation |
Parts packaging code | DIP | DIP | DIP |
package instruction | DIP, | DIP, | DIP, |
Contacts | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609 code | e3 | e3 | e3 |
damage rate | 1:2 | 2:3 | 2:3 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 2.5 V | 2.5 V | 2.5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Telecom integrated circuit types | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | MATTE TIN | MATTE TIN | MATTE TIN |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL |