2M X 16 FLASH 3V PROM, 60 ns, PDSO48
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 |
Contacts | 48 |
Reach Compliance Code | unknow |
ECCN code | 3A991.B.1.A |
Factory Lead Time | 1 week |
Maximum access time | 70 ns |
Other features | BOTTOM BOOT BLOCK |
Spare memory width | 8 |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 8.15 mm |
memory density | 33554432 bi |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 8,63 |
Number of terminals | 48 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA48,6X8,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1 mm |
Department size | 8K,64K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.045 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |
width | 6.15 mm |
Base Number Matches | 1 |