MCM63Z918ZP166 datasheet, PDF - EEWORLD Datasheet

MCM63Z918ZP166: Description512KX18 ZBT SRAM, 3.6ns, PBGA119, PLASTIC, BGA-119; Categorystorage storage; File Size355KB，32 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MCM63Z918ZP166 Overview

512KX18 ZBT SRAM, 3.6ns, PBGA119, PLASTIC, BGA-119

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
Parts packaging code	BGA
package instruction	BGA,
Contacts	119
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	3.6 ns
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	18
Number of functions	1
Number of terminals	119
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX18
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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